Inventor
HORIE KUNIAKI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “HORIE KUNIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EBARA CORP
25 patentsUS6488774B1Dec 3, 2002
Trap apparatus
EBARA CORP378 citations99
US6282368B1Aug 28, 2001
Liquid feed vaporization system and gas injection device
EBARA CORP104 citations99
US6132512AOct 17, 2000
Vapor-phase film growth apparatus and gas ejection head
EBARA CORP225 citations99
US5951923ASep 14, 1999
Vaporizer apparatus and film deposition apparatus therewith
EBARA CORP275 citations99
US6176929B1Jan 23, 2001
Thin-film deposition apparatus
EBARA CORP340 citations98
US6387182B1May 14, 2002
Apparatus and method for processing substrate
EBARA CORP113 citations97
US6921722B2Jul 26, 2005
Coating, modification and etching of substrate surface with particle beam irradiation of the same
EBARA CORP56 citations96
US6419462B1Jul 16, 2002
Positive displacement type liquid-delivery apparatus
EBARA CORP169 citations96
US6195504B1Feb 27, 2001
Liquid feed vaporization system and gas injection device
EBARA CORP58 citations96
US5862605AJan 26, 1999
Vaporizer apparatus
EBARA CORP62 citations96
US7601248B2Oct 13, 2009
Substrate holder and plating apparatus
EBARA CORP11 citations92
US6517642B2Feb 11, 2003
Method and apparatus of producing thin film of metal or metal compound
EBARA CORP25 citations92
US6269221B1Jul 31, 2001
Liquid feed vaporization system and gas injection device
EBARA CORP16 citations92
US6116267ASep 12, 2000
Valving device
EBARA CORP29 citations92
US5950646ASep 14, 1999
Vapor feed supply system
EBARA CORP23 citations92
US6972256B2Dec 6, 2005
Method and apparatus for forming thin film of metal
EBARA CORP17 citations84
US6730596B1May 4, 2004
Method of and apparatus for forming interconnection
EBARA CORP19 citations84
US6780245B2Aug 24, 2004
Method and apparatus of producing thin film of metal or metal compound
EBARA CORP7 citations74
US6458694B2Oct 1, 2002
High energy sputtering method for forming interconnects
EBARA CORP7 citations74
US7901551B2Mar 8, 2011
Substrate holder and plating apparatus
EBARA CORP5 citations73
US9624596B2Apr 18, 2017
Electrochemical deposition method
EBARA CORP3 citations72
US9388505B2Jul 12, 2016
Electrochemical deposition method
EBARA CORP1 citations62
US8936705B2Jan 20, 2015
Electrochemical deposition apparatus
EBARA CORP1 citations62
US9593430B2Mar 14, 2017
Electrochemical deposition method
EBARA CORP1 citations51
US9506162B2Nov 29, 2016
Electrochemical deposition method
EBARA CORP0 citations51