Inventor

JOMAA HOUSSAM

US26 patents

⚠️ This page may combine multiple inventors who share the name “JOMAA HOUSSAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JOMAA HOUSSAM

INTEL CORP

Integrated circuit and process for fabricating thereof

Substrate with embedded stacked through-silicon via die

Method of enabling selective area plating on a substrate

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

Optical die structures and associated package substrates

Microball placement solutions

Alternative to desmear for build-up roughening and copper adhesion promotion

Substrate with embedded stacked through-silicon via die

Selective electroless plating for electronic substrates

Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby

Removing dry film resist residues using hydrolyzable membranes

JOMAA HOUSSAM

Method of manufacturing coreless substrate

Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same

Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same

Alternative to desmear for build-up roughening and copper adhesion promotion

Methods for the fabrication of microelectronic device substrates by attaching two cores together during fabrication

QUALCOMM INC

High density interconnects in an embedded trace substrate (ETS) comprising a core layer

Integrated circuit (IC) package and package substrate comprising stacked vias

High density embedded interconnects in substrate

Low profile integrated package

GONZALEZ JAVIER SOTO

Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same

Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same

Substrate with embedded stacked through-silicon via die

BCHIR OMAR J

Substrates for optical die structures

NALLA RAVI

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

GURUMURTHY CHARAN

Integrated circuit and process for fabricating thereof