Inventor

SHAVIV ROEY

US52 patents

⚠️ This page may combine multiple inventors who share the name “SHAVIV ROEY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHAVIV ROEY

APPLIED MATERIALS INC

Apparatus and method for controlling a flow process material to a deposition chamber

Methods for producing interconnects in semiconductor devices

Method for forming interconnects

Evaporator chamber for forming films on substrates

Selective cobalt removal for bottom up gapfill

Methods for producing interconnects in semiconductor devices

Co or Ni and Cu integration for small and large features in integrated circuits

Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD

Method for forming interconnects

Electrochemical plating methods

Showerhead for providing multiple materials to a process chamber

Methods and apparatus for forming dual metal interconnects

Apparatus and method for controlling a flow process material to a deposition chamber

Methods of using a segmented showerhead for uniform delivery of multiple pre-cursors

Segmented showerhead for uniform delivery of multiple precursors

Magnetized substrate carrier apparatus with shadow mask for deposition

Methods and apparatus for hybrid feature metallization

Methods for forming films on substrates

Methods for forming films on substrates

Methods and apparatus for forming dual metal interconnects

Enhanced plating bath and additive chemistries for cobalt plating

Enhanced plating bath and additive chemistries for cobalt plating

Substrate carrier having hard mask

Low resistance and high reliability metallization module

Selective cobalt removal for bottom up gapfill

Co or Ni and Cu integration for small and large features in integrated circuits

Electroplating apparatus with membrane tube shield

Electroplating apparatus with membrane tube shield

Methods and apparatus for filling a feature disposed in a substrate

Methods for asymmetric deposition of metal on high aspect ratio nanostructures

Alignment module with a cleaning chamber

System and method for aligning a mask with a substrate

Electrochemical plating methods

Processing system for forming layers

Methods of electrochemical deposition for void-free gap fill

Forming cobalt interconnections on a substrate

NOVELLUS SYSTEMS INC

Protective self-aligned buffer layers for damascene interconnects

Protection of Cu damascene interconnects by formation of a self-aligned buffer layer

Methods of forming tensile tungsten films and compressive tungsten films

Protection of Cu damascene interconnects by formation of a self-aligned buffer layer

Protective self-aligned buffer layers for damascene interconnects

Protective self-aligned buffer layers for damascene interconnects

PVD-based metallization methods for fabrication of interconnections in semiconductor devices

PVD-based metallization methods for fabrication of interconnections in semiconductor devices

Diffusion barrier layers

Methods for fabricating semiconductor structures with backside stress layers

SHAVIV ROEY

Conformal films on semiconductor substrates

Conformal films on semiconductor substrates

Photoresist strip processes for improved device integrity

YU JENGYI

Metal and silicon containing capping layers for interconnects