Inventor
DARMAWIKARTA KRISTOF KUWAWI
US16 patents
Patents
16 patentsUS11521931B2Dec 6, 2022
Microelectronic structures including bridges
INTEL CORP7 citations84
US11107781B2Aug 31, 2021
RFIC having coaxial interconnect and molded layer
INTEL CORP3 citations73
US10872872B2Dec 22, 2020
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling
INTEL CORP4 citations72
US10790233B2Sep 29, 2020
Package substrates with integral devices
INTEL CORP5 citations72
US12176223B2Dec 24, 2024
Integrated circuit package supports
INTEL CORP0 citations62
US11854834B2Dec 26, 2023
Integrated circuit package supports
INTEL CORP0 citations62
US11532584B2Dec 20, 2022
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling
INTEL CORP1 citations62
US11309192B2Apr 19, 2022
Integrated circuit package supports
INTEL CORP0 citations62
US11244912B2Feb 8, 2022
Semiconductor package having a coaxial first layer interconnect
INTEL CORP0 citations62
US11037802B2Jun 15, 2021
Package substrate having copper alloy sputter seed layer and high density interconnects
INTEL CORP0 citations62
US12546957B2Feb 10, 2026
Photonic integrated circuit packaging architectures
INTEL CORP1 citations60
US11075130B2Jul 27, 2021
Package substrate having polymer-derived ceramic core
INTEL CORP0 citations58
US11942334B2Mar 26, 2024
Microelectronic assemblies having conductive structures with different thicknesses
INTEL CORP0 citations50
US11652036B2May 16, 2023
Via-trace structures
INTEL CORP0 citations50
US12249584B2Mar 11, 2025
Microelectronic assemblies having integrated magnetic core inductors
INTEL CORP0 citations49
US10026691B2Jul 17, 2018
Package substrate having noncircular interconnects
INTEL CORP0 citations45