Inventor
LEE JAE SIK
US27 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
20 patentsUS9443824B1Sep 13, 2016
Cavity bridge connection for die split architecture
QUALCOMM INC102 citations98
US9368450B1Jun 14, 2016
Integrated device package comprising bridge in litho-etchable layer
QUALCOMM INC119 citations98
US9679855B1Jun 13, 2017
Polymer crack stop seal ring structure in wafer level package
QUALCOMM INC20 citations90
US9595496B2Mar 14, 2017
Integrated device package comprising silicon bridge in an encapsulation layer
QUALCOMM INC17 citations84
US9583462B2Feb 28, 2017
Damascene re-distribution layer (RDL) in fan out split die application
QUALCOMM INC10 citations84
US9472425B2Oct 18, 2016
Power distribution improvement using pseudo-ESR control of an embedded passive capacitor
QUALCOMM INC8 citations84
US9418877B2Aug 16, 2016
Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers
QUALCOMM INC14 citations84
US9401350B1Jul 26, 2016
Package-on-package (POP) structure including multiple dies
QUALCOMM INC13 citations84
US10157823B2Dec 18, 2018
High density fan out package structure
QUALCOMM INC6 citations73
US9799628B2Oct 24, 2017
Stacked package configurations and methods of making the same
QUALCOMM INC2 citations73
US9633950B1Apr 25, 2017
Integrated device comprising flexible connector between integrated circuit (IC) packages
QUALCOMM INC5 citations73
US9613942B2Apr 4, 2017
Interposer for a package-on-package structure
QUALCOMM INC5 citations73
US9595494B2Mar 14, 2017
Semiconductor package with high density die to die connection and method of making the same
QUALCOMM INC3 citations73
US9596768B2Mar 14, 2017
Substrate with conductive vias
QUALCOMM INC6 citations73
US9355963B2May 31, 2016
Semiconductor package interconnections and method of making the same
QUALCOMM INC4 citations73
US9230936B2Jan 5, 2016
Integrated device comprising high density interconnects and redistribution layers
QUALCOMM INC4 citations73
US10049977B2Aug 14, 2018
Semiconductor package on package structure and method of forming the same
QUALCOMM INC0 citations52
US9881859B2Jan 30, 2018
Substrate block for PoP package
QUALCOMM INC1 citations52
US9466554B2Oct 11, 2016
Integrated device comprising via with side barrier layer traversing encapsulation layer
QUALCOMM INC0 citations52
US9269610B2Feb 23, 2016
Pattern between pattern for low profile substrate
QUALCOMM INC0 citations52
DENTCA INC
4 patentsUS9456963B2Oct 4, 2016
Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base
DENTCA INC15 citations83
US9675432B2Jun 13, 2017
Method and apparatus for preparing removable dental prosthesis
DENTCA INC20 citations80
US10568814B2Feb 25, 2020
Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base
DENTCA INC2 citations72
US10357435B2Jul 23, 2019
Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base
DENTCA INC2 citations72