Inventor

CHERN CHYI-SHYUAN

TW54 patents

⚠️ This page may combine multiple inventors who share the name “CHERN CHYI-SHYUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHERN CHYI-SHYUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Multi-zone temperature control for semiconductor wafer

Pellicle and method for manufacturing the same

Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure

Ellipsometer and method for estimating thickness of film

Apparatus and method for generating an electromagnetic radiation

Apparatus and method for generating an electromagnetic radiation

Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure

Ellipsometer and method for estimating thickness of film

Apparatus and method for generating an electromagnetic radiation

Multi-zone temperature control for semiconductor wafer

Microwave and infrared heating units for wet chemicals

Wet chemical heating system and a method of chemical mechanical polishing

Method of manufacturing semiconductor devices

TAIWAN SEMICONDUCTOR MFG

High selectivity etching process for metal gate N/P patterning

Formation of shallow trench isolation using chemical vapor etch

Method of fabricating high-k metal gate devices

Integration of bottom-up metal film deposition

N/P metal crystal orientation for high-k metal gate Vt modulation

Retainer ring

Retainer ring

Electroplating systems and methods

TSMC SOLID STATE LIGHTING LTD

Doubled substrate multi-junction light emitting diode array structure

Light emitting diode

Methods of fabricating light emitting diode devices

Shadow mask assembly

LED device with improved thermal performance

Method and apparatus for accurate die-to-wafer bonding

Method and apparatus for accurate die-to-wafer bonding

Methods of forming through silicon via openings

YU CHIH-KUANG

Methods of fabricating light emitting diode packages

Methods of fabricating light emitting diode packages

Double substrate multi-junction light emitting diode array structure

LIN SIMON SU-HORNG

Integration of bottom-up metal film deposition

Integration of bottom-up metal film deposition

N/P metal crystal orientation for high-K metal gate Vt modulation

CHERN CHYI SHYUAN

Method and apparatus for accurate die-to-wafer bonding

Methods of forming through silicon via openings

Light emitting diode emitter substrate with highly reflective metal bonding

HUANG KUO BIN

High temperature anneal for aluminum surface protection

Device with aluminum surface protection

LEE TZE-LIANG

Method for fabricating an isolation structure

Method for fabricating an isolation structure

CHANG CHUN-LIN

Multi-zone temperature control for semiconductor wafer

LEE HSIAO-WEN

Refractive index tuning of wafer level package LEDs

HUNG KUN-KU

Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method

HSIA HSING-KUO

LED device with improved thermal performance

YANG CHUNG-RU

Field-by-field laser annealing and feed forward process control

EPISTAR CORP

LED device with improved thermal performance

CHANG YI-PIN

Piping system and control for semiconductor processing

CHENG NAI-HAN

Method and system for controlling an implantation process