Inventor
KAMIYAMA EIJI
JP11 patents
⚠️ This page may combine multiple inventors who share the name “KAMIYAMA EIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
4 patentsUS7491342B2Feb 17, 2009
Bonded semiconductor substrate manufacturing method thereof
SUMCO CORP33 citations92
US8379196B2Feb 19, 2013
Method for judging whether semiconductor wafer is non-defective wafer by using laser scattering method
SUMCO CORP4 citations62
US7655315B2Feb 2, 2010
SOI substrate, silicon substrate therefor and it's manufacturing method
SUMCO CORP5 citations62
US7838387B2Nov 23, 2010
Method for manufacturing SOI wafer
SUMCO CORP0 citations41
KAMIYAMA EIJI
3 patentsUS8284395B2Oct 9, 2012
Wafer surface measuring apparatus
KAMIYAMA EIJI3 citations59
US8339593B2Dec 25, 2012
System and method of two-stepped laser scattering defect inspection
KAMIYAMA EIJI1 citations48
US8761488B2Jun 24, 2014
Image data processing method and image creating method
KAMIYAMA EIJI1 citations44
SUMITOMO MITSUBISHI SILICON
2 patentsUS7947572B2May 24, 2011
Method of manufacturing a SOI structure having a SiGe layer interposed between the silicon and the insulator
SUMITOMO MITSUBISHI SILICON7 citations80
US7741193B2Jun 22, 2010
SOI structure having a SiGe layer interposed between the silicon and the insulator
SUMITOMO MITSUBISHI SILICON3 citations59