Inventor
WU YING-CHENG
TW32 patents
⚠️ This page may combine multiple inventors who share the name “WU YING-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ALTUS TECHNOLOGY INC
13 patentsUS7408205B2Aug 5, 2008
Digital camera module
ALTUS TECHNOLOGY INC22 citations92
US7643081B2Jan 5, 2010
Digital camera module with small sized image sensor chip package
ALTUS TECHNOLOGY INC11 citations83
US7460317B2Dec 2, 2008
Digital camera module with improved image quality
ALTUS TECHNOLOGY INC12 citations83
US7365421B2Apr 29, 2008
IC chip package with isolated vias
ALTUS TECHNOLOGY INC7 citations72
US7626160B2Dec 1, 2009
Image sensing module with improved assembly precision
ALTUS TECHNOLOGY INC2 citations63
US7554184B2Jun 30, 2009
Image sensor chip package
ALTUS TECHNOLOGY INC5 citations63
US7646429B2Jan 12, 2010
Digital camera module packaging method
ALTUS TECHNOLOGY INC3 citations62
US7595839B2Sep 29, 2009
Image sensor chip packaging method
ALTUS TECHNOLOGY INC5 citations62
US7342215B2Mar 11, 2008
Digital camera module package fabrication method
ALTUS TECHNOLOGY INC4 citations62
US7540672B2Jun 2, 2009
Digital still camera module
ALTUS TECHNOLOGY INC4 citations61
US7417327B2Aug 26, 2008
IC chip package with cover
ALTUS TECHNOLOGY INC2 citations61
US7538862B2May 26, 2009
Testing system for digital camera modules
ALTUS TECHNOLOGY INC0 citations45
US7592197B2Sep 22, 2009
Image sensor chip package fabrication method
ALTUS TECHNOLOGY INC0 citations41
HON HAI PREC IND CO LTD
9 patentsUS7729606B2Jun 1, 2010
Lens module and digital camera module using same
HON HAI PREC IND CO LTD14 citations84
US7521770B2Apr 21, 2009
Image capturing device
HON HAI PREC IND CO LTD10 citations80
US7696465B2Apr 13, 2010
Image sensor package, camera module having same and manufacturing method for the same
HON HAI PREC IND CO LTD6 citations70
US7796188B2Sep 14, 2010
Compact image sensor package and method of manufacturing the same
HON HAI PREC IND CO LTD2 citations63
US7638864B2Dec 29, 2009
Chip package, method of making same and digital camera module using the package
HON HAI PREC IND CO LTD5 citations63
US7929033B2Apr 19, 2011
Image sensor package and camera module having same
HON HAI PREC IND CO LTD5 citations60
US7696619B2Apr 13, 2010
Stack combination of plural chip package units
HON HAI PREC IND CO LTD3 citations59
US7821565B2Oct 26, 2010
Imaging module package
HON HAI PREC IND CO LTD2 citations55
US7916212B2Mar 29, 2011
Image sensor package and camera module utilizing the same
HON HAI PREC IND CO LTD4 citations54
REALTEK SEMICONDUCTOR CORP
7 patentsUS10630308B2Apr 21, 2020
Analog-to-digital converter with low inter-symbol interference and reduced common-mode voltage mismatch
REALTEK SEMICONDUCTOR CORP3 citations73
US10367517B2Jul 30, 2019
Analog to digital conversion apparatus and analog to digital converter calibration method of the same
REALTEK SEMICONDUCTOR CORP3 citations73
US10312925B1Jun 4, 2019
Multiplying DAC of pipelined ADC
REALTEK SEMICONDUCTOR CORP3 citations73
US12506487B2Dec 23, 2025
Compensation circuit and compensation method for successive-approximation register (SAR) analog-to-digital converter (ADC)
REALTEK SEMICONDUCTOR CORP0 citations62
US11418206B2Aug 16, 2022
Flash analog to digital converter and calibration method
REALTEK SEMICONDUCTOR CORP0 citations52
US12341518B2Jun 24, 2025
Latch
REALTEK SEMICONDUCTOR CORP0 citations50
US12562746B2Feb 24, 2026
Wired communication receiver with DC level shift
REALTEK SEMICONDUCTOR CORP0 citations46