Inventor
KITTL JORGE A
US51 patents
⚠️ This page may combine multiple inventors who share the name “KITTL JORGE A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
39 patentsUS9941405B2Apr 10, 2018
Nanosheet and nanowire devices having source/drain stressors and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD25 citations94
US10878317B2Dec 29, 2020
Method and system for performing analog complex vector-matrix multiplication
SAMSUNG ELECTRONICS CO LTD13 citations86
US11461620B2Oct 4, 2022
Multi-bit, SoC-compatible neuromorphic weight cell using ferroelectric FETs
SAMSUNG ELECTRONICS CO LTD5 citations84
US9773886B1Sep 26, 2017
Nanosheet and nanowire devices having doped internal spacers and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD14 citations84
US9601586B1Mar 21, 2017
Methods of forming semiconductor devices, including forming a metal layer on source/drain regions
SAMSUNG ELECTRONICS CO LTD18 citations84
US9484423B2Nov 1, 2016
Crystalline multiple-nanosheet III-V channel FETs
SAMSUNG ELECTRONICS CO LTD16 citations84
US10790002B2Sep 29, 2020
Giant spin hall-based compact neuromorphic cell optimized for differential read inference
SAMSUNG ELECTRONICS CO LTD5 citations83
US9831323B2Nov 28, 2017
Structure and method to achieve compressively strained Si NS
SAMSUNG ELECTRONICS CO LTD8 citations82
US9768062B1Sep 19, 2017
Method for forming low parasitic capacitance source and drain contacts
SAMSUNG ELECTRONICS CO LTD8 citations80
US10909449B2Feb 2, 2021
Monolithic multi-bit weight cell for neuromorphic computing
SAMSUNG ELECTRONICS CO LTD3 citations73
US10679688B2Jun 9, 2020
Ferroelectric-based memory cell usable in on-logic chip memory
SAMSUNG ELECTRONICS CO LTD3 citations73
US10170549B2Jan 1, 2019
Strained stacked nanosheet FETs and/or quantum well stacked nanosheet
SAMSUNG ELECTRONICS CO LTD4 citations73
US9978833B2May 22, 2018
Methods for varied strain on nano-scale field effect transistor devices
SAMSUNG ELECTRONICS CO LTD5 citations73
US9893187B2Feb 13, 2018
Sacrificial non-epitaxial gate stressors
SAMSUNG ELECTRONICS CO LTD2 citations73
US9634140B2Apr 25, 2017
Fabricating metal source-drain stressor in a MOS device channel
SAMSUNG ELECTRONICS CO LTD4 citations73
US9613907B2Apr 4, 2017
Low resistivity damascene interconnect
SAMSUNG ELECTRONICS CO LTD4 citations73
US9431529B2Aug 30, 2016
Confined semi-metal field effect transistor
SAMSUNG ELECTRONICS CO LTD3 citations73
US9847245B1Dec 19, 2017
Filling processes
SAMSUNG ELECTRONICS CO LTD4 citations72
US12260324B2Mar 25, 2025
Monolithic multi-bit weight cell for neuromorphic computing
SAMSUNG ELECTRONICS CO LTD0 citations62
US11816563B2Nov 14, 2023
Method of enabling sparse neural networks on memresistive accelerators
SAMSUNG ELECTRONICS CO LTD0 citations62
US11769540B2Sep 26, 2023
Giant spin hall-based compact neuromorphic cell optimized for differential read inference
SAMSUNG ELECTRONICS CO LTD0 citations62
US11727258B2Aug 15, 2023
Multi-bit, SoC-compatible neuromorphic weight cell using ferroelectric FETs
SAMSUNG ELECTRONICS CO LTD0 citations62
US11574193B2Feb 7, 2023
Method and system for training of neural networks using continuously differentiable models
SAMSUNG ELECTRONICS CO LTD1 citations62
US11348629B2May 31, 2022
Giant spin hall-based compact neuromorphic cell optimized for differential read inference
SAMSUNG ELECTRONICS CO LTD0 citations62
US11289419B2Mar 29, 2022
Interconnects having long grains and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10739186B2Aug 11, 2020
Bi-directional weight cell
SAMSUNG ELECTRONICS CO LTD1 citations62
US10614868B2Apr 7, 2020
Memory device with strong polarization coupling
SAMSUNG ELECTRONICS CO LTD1 citations62
US10461751B2Oct 29, 2019
FE-FET-based XNOR cell usable in neuromorphic computing
SAMSUNG ELECTRONICS CO LTD1 citations62
US11290110B2Mar 29, 2022
Method and system for providing a variation resistant magnetic junction-based XNOR cell usable in neuromorphic computing
SAMSUNG ELECTRONICS CO LTD0 citations52
US9966449B2May 8, 2018
Methods of forming semiconductor devices, including forming a contact including an alkaline earth metal on a semiconductor layer, and related devices
SAMSUNG ELECTRONICS CO LTD1 citations52
US9871139B2Jan 16, 2018
Sacrificial epitaxial gate stressors
SAMSUNG ELECTRONICS CO LTD1 citations52
US9698234B2Jul 4, 2017
Interface layer for gate stack using O3 post treatment
SAMSUNG ELECTRONICS CO LTD0 citations52
US9685509B2Jun 20, 2017
Finfet devices including high mobility channel materials with materials of graded composition in recessed source/drain regions
SAMSUNG ELECTRONICS CO LTD1 citations52
US9525053B2Dec 20, 2016
Integrated circuit devices including strained channel regions and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US9431492B2Aug 30, 2016
Integrated circuit devices including contacts and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US11217392B2Jan 4, 2022
Composite piezoelectric capacitor
SAMSUNG ELECTRONICS CO LTD0 citations51
US10763207B2Sep 1, 2020
Interconnects having long grains and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US9406508B2Aug 2, 2016
Methods of forming a semiconductor layer including germanium with low defectivity
SAMSUNG ELECTRONICS CO LTD0 citations42
US10510886B2Dec 17, 2019
Method of providing reacted metal source-drain stressors for tensile channel stress
SAMSUNG ELECTRONICS CO LTD0 citations41
TEXAS INSTRUMENTS INC
7 patentsUS6187656B1Feb 13, 2001
CVD-based process for manufacturing stable low-resistivity poly-metal gate electrodes
TEXAS INSTRUMENTS INC58 citations94
US6372566B1Apr 16, 2002
Method of forming a silicide layer using metallic impurities and pre-amorphization
TEXAS INSTRUMENTS INC25 citations93
US6326289B1Dec 4, 2001
Method of forming a silicide layer using a pre-amorphization implant which is blocked from source/drain regions by a layer of photoresist
TEXAS INSTRUMENTS INC25 citations93
US6204132B1Mar 20, 2001
Method of forming a silicide layer using an angled pre-amorphization implant
TEXAS INSTRUMENTS INC32 citations90
US6048784AApr 11, 2000
Transistor having an improved salicided gate and method of construction
TEXAS INSTRUMENTS INC9 citations74
US7825025B2Nov 2, 2010
Method and system for improved nickel silicide
TEXAS INSTRUMENTS INC5 citations62
US8372750B2Feb 12, 2013
Method and system for improved nickel silicide
TEXAS INSTRUMENTS INC0 citations51
KITTL JORGE A
3 patentsUS10283638B2May 7, 2019
Structure and method to achieve large strain in NS without addition of stack-generated defects
KITTL JORGE A1 citations60
US10297673B2May 21, 2019
Methods of forming semiconductor devices including conductive contacts on source/drains
KITTL JORGE A0 citations49
US9917158B2Mar 13, 2018
Device contact structures including heterojunctions for low contact resistance
KITTL JORGE A1 citations42
OBRADOVIC BORNA J
1 patentShowing the top 50 of 51 patents by PatentIndex Score.