Inventor

YIM CHOONGBIN

KR21 patents

⚠️ This page may combine multiple inventors who share the name “YIM CHOONGBIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YIM CHOONGBIN

SAMSUNG ELECTRONICS CO LTD

Semiconductor package

Semiconductor package with interposer

Semiconductor packages and methods of manufacturing the same

Semiconductor package

Methods of manufacturing semiconductor packages

Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same

Semiconductor package including interposer and method of manufacturing the semiconductor package

Semiconductor package including interposer and method of manufacturing the semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package and manufacturing method thereof

Semiconductor package having semiconductor chip positioned in cavity of cover wiring structure

Semiconductor package substrate and semiconductor package including the same

Interposer and semiconductor package including the same

Semiconductor packages and methods of manufacturing the same

Semiconductor package, and package on package having the same

YIM CHOONGBIN

Package-on-package electronic devices including sealing layers and related methods of forming the same

Package-on-package electronic devices including sealing layers and related methods of forming the same

Method of forming a semiconductor device package

STATS CHIPPAC LTD

Stackable package by using internal stacking modules

Stackable package by using internal stacking modules

LEE JINHO

Semiconductor packages and methods of fabricating the same