Inventor
CHEW BENG CHYE
SG12 patents
Patents
12 patentsUS7309623B2Dec 18, 2007
Method of fabricating a stacked die in die BGA package
MICRON TECHNOLOGY INC45 citations95
US7371608B2May 13, 2008
Method of fabricating a stacked die having a recess in a die BGA package
MICRON TECHNOLOGY INC12 citations92
US7344969B2Mar 18, 2008
Stacked die in die BGA package
MICRON TECHNOLOGY INC13 citations92
US7332820B2Feb 19, 2008
Stacked die in die BGA package
MICRON TECHNOLOGY INC16 citations92
US7332819B2Feb 19, 2008
Stacked die in die BGA package
MICRON TECHNOLOGY INC16 citations92
US7282390B2Oct 16, 2007
Stacked die-in-die BGA package with die having a recess
MICRON TECHNOLOGY INC19 citations92
US8373277B2Feb 12, 2013
Stacked die in die BGA package
MICRON TECHNOLOGY INC6 citations83
US7799610B2Sep 21, 2010
Method of fabricating a stacked die having a recess in a die BGA package
MICRON TECHNOLOGY INC7 citations81
US7282392B2Oct 16, 2007
Method of fabricating a stacked die in die BGA package
MICRON TECHNOLOGY INC8 citations81
US7575953B2Aug 18, 2009
Stacked die with a recess in a die BGA package
MICRON TECHNOLOGY INC4 citations73
US7358117B2Apr 15, 2008
Stacked die in die BGA package
MICRON TECHNOLOGY INC5 citations73
US7691680B2Apr 6, 2010
Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
MICRON TECHNOLOGY INC0 citations46