Inventor

WU WENG-JIN

TW85 patents

⚠️ This page may combine multiple inventors who share the name “WU WENG-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU WENG-JIN

TAIWAN SEMICONDUCTOR MFG

Multi-die stacking using bumps with different sizes

Three dimensional integrated circuit and method of making the same

Three-dimensional integrated circuits with protection layers

Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect

Structure and method for stacked wafer fabrication

Formation of through via before contact processing

Three-dimensional integrated circuits with protection layers

Semiconductor contact structure

Backside through vias in a bonded structure

Barrier for through-silicon via

Method for stacking semiconductor dies

Barrier for through-silicon via

Method for stacking semiconductor dies

Stacked structures and methods of fabricating stacked structures

Performing die-to-wafer stacking by filling gaps between dies

High throughput die-to-wafer bonding using pre-alignment

Protection for bonding pads and methods of formation

Barrier for through-silicon via

SEMICONDUCTOR COMPONENTS IND LLC

Stacked image sensor package

Molded image sensor chip scale packages and related methods

Controllable gap height for an image sensor package

Molded image sensor chip scale packages and related methods

Packaging structure for a sensor having a sealing layer

Embedded image sensor semiconductor packages and related methods

Embedded image sensor semiconductor packages and related methods

Embedded image sensor semiconductor packages and related methods

Image sensors with contamination barrier structures

Image sensor semiconductor packages and related methods

Controllable gap height for an image sensor package

CHIOU WEN-CHIH

Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips

Formation of through via before contact processing

Protection layer for adhesive material at wafer edge

Protection layer for adhesive material at wafer edge

Methods of forming through via

YANG KU-FENG

Wafer bonding

Backside process for a substrate

Method for thinning a wafer

Vacuum wafer carriers for strengthening thin wafers

TAIWAN SEMICONDUCTOR MFG CO LTD

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

Stacked structures and methods of forming stacked structures

System, structure, and method of manufacturing a semiconductor substrate stack

Alignment mark and method of formation

WU WENG-JIN

Multi-die stacking using bumps with different sizes

Stacked structures and methods of forming stacked structures

CHANG HUNG-PIN

System, structure, and method of manufacturing a semiconductor substrate stack

IND TECH RES INST

Integrated surface-emitting optoelectronic module and the method for making the same

YU CHEN-HUA

Three-dimensional integrated circuits with protection layers

TSAI CHEN-YU

Alignment mark and method of formation

LIN JING-CHENG

Method of three dimensional integrated circuit assembly

LIU MAX

Barrier structures and methods for through substrate vias