Inventor

KUO LI-CHUNG

TW31 patents

⚠️ This page may combine multiple inventors who share the name “KUO LI-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUO LI-CHUNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Dummy die placement without backside chipping

Underfill structure for semiconductor packages and methods of forming the same

Sawing underfill in packaging processes

Sawing underfill in packaging processes

Underfill structure for semiconductor packages and methods of forming the same

Dummy die placement without backside chipping

Package structure and method of fabricating the same

Package structure and method of manufacturing the same

Die-to-die gap control for semiconductor structure and method

Method of forming a dummy die of an integrated circuit having an embedded annular structure

Packages with multiple types of underfill and method forming the same

Integrated circuit package and method of forming same

Packages with multiple types of underfill and method forming the same

Underfill structure for semiconductor packages and methods of forming the same

Semiconductor package and method of forming the same

Thermal interface materials, 3D semiconductor packages and methods of manufacture

Integrated circuit package and method of forming same

Dummy die placement without backside chipping

Underfill structure for semiconductor packages and methods of forming the same

Semiconductor package and method of forming the same

Sawing underfill in packaging processes

Thermal interface materials, 3D semiconductor packages and methods of manufacture

Method of manufacture of a semiconductor device

Method of manufacture of a semiconductor device

Semiconductor package and method of forming the same

Semiconductor device package and method of manufacturing the same

Semiconductor package and method

LIN JING-CHENG

Die-to-die gap control for semiconductor structure and method

Die structure and method of fabrication thereof

LU SZU WEI

Sawing underfill in packaging processes

UNIV NAT TAIWAN

Hole or electron injection polymers and prepolymers, hole or electron transport polymers and prepolymers, method for forming the same, and their application