Inventor
LI PAI YUAN
TW11 patents
Patents
11 patentsUS10770405B2Sep 8, 2020
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10707177B2Jul 7, 2020
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10629545B2Apr 21, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11916023B2Feb 27, 2024
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US12165990B2Dec 10, 2024
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587886B2Feb 21, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11201097B2Dec 14, 2021
Method of manufacture of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11121050B2Sep 14, 2021
Method of manufacture of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867951B2Dec 15, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US10872871B2Dec 22, 2020
Chip package structure with dummy bump and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10340242B2Jul 2, 2019
Semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48