P

Inventor

WENG TZU-CHAN

TW37 patents
⚠️ This page may combine multiple inventors who share the name “WENG TZU-CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

35 patents
US9812363B1Nov 7, 2017

FinFET device and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD237 citations99
US10170555B1Jan 1, 2019

Intermetallic doping film with diffusion in source/drain

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations94
US10522408B2Dec 31, 2019

FinFET device and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10510875B2Dec 17, 2019

Source and drain structure with reduced contact resistance and enhanced mobility

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10163715B2Dec 25, 2018

FinFET device and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10679950B2Jun 9, 2020

Methods of forming recesses in substrates by etching dummy Fins

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US10297555B2May 21, 2019

Integrated circuit structure having crown-shaped semiconductor strips and recesses in the substrate from etched dummy fins

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations83
US11545562B2Jan 3, 2023

Source and drain structure with reduced contact resistance and enhanced mobility

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10163650B2Dec 25, 2018

System and method for selective nitride etch

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11600713B2Mar 7, 2023

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10734246B2Aug 4, 2020

Heat shield for chamber door and devices manufactured using same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US12424568B2Sep 23, 2025

Method for forming recesses in a substrate by etching dummy fins

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002855B2Jun 4, 2024

Method of manufacturing a semiconductor device and a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11522050B2Dec 6, 2022

Method of manufacturing a semiconductor device and a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11488912B2Nov 1, 2022

Method for forming recesses in a substrate by etching dummy fins

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300741B2May 13, 2025

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12125707B2Oct 22, 2024

Fin field-effect transistor device and method of forming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12015085B2Jun 18, 2024

Method of manufacturing a semiconductor device including etching polysilicon

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11532481B2Dec 20, 2022

Fin field-effect transistor device and method of forming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11430893B2Aug 30, 2022

Method of manufacturing a semiconductor device and a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12074032B2Aug 27, 2024

Heat shield for chamber door and devices manufactured using same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11031252B2Jun 8, 2021

Heat shield for chamber door and devices manufactured using same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11120986B2Sep 14, 2021

Etching using chamber with top plate formed of non-oxygen containing material

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10504720B2Dec 10, 2019

Etching using chamber with top plate formed of non-oxygen containing material

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US12432955B2Sep 30, 2025

Source and drain structure with reduced contact resistance and enhanced mobility

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9391072B2Jul 12, 2016

Sacrificial oxide with uniform thickness

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9136109B2Sep 15, 2015

Sacrificial oxide with uniform thickness

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10861800B2Dec 8, 2020

Integrated circuit structure having a crown-shaped semiconductor strip and an isolation region recessed in the substrate

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10825739B2Nov 3, 2020

FinFET devices and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10510615B2Dec 17, 2019

FinFET devices and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9721805B1Aug 1, 2017

Formation method of semiconductor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations49
US10032661B2Jul 24, 2018

Semiconductor device, method, and tool of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations45
US10269938B2Apr 23, 2019

Semiconductor device structure having a doped passivation layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations39
US10163642B2Dec 25, 2018

Semiconductor device, method and tool of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations37
US9543410B2Jan 10, 2017

Semiconductor device and formation thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations36

TAIWAN SEMICONDUCTOR MFG

2 patents