Inventor
WENG TZU-CHAN
TW37 patents
⚠️ This page may combine multiple inventors who share the name “WENG TZU-CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
35 patentsUS9812363B1Nov 7, 2017
FinFET device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD237 citations99
US10170555B1Jan 1, 2019
Intermetallic doping film with diffusion in source/drain
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations94
US10522408B2Dec 31, 2019
FinFET device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10510875B2Dec 17, 2019
Source and drain structure with reduced contact resistance and enhanced mobility
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10163715B2Dec 25, 2018
FinFET device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10679950B2Jun 9, 2020
Methods of forming recesses in substrates by etching dummy Fins
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US10297555B2May 21, 2019
Integrated circuit structure having crown-shaped semiconductor strips and recesses in the substrate from etched dummy fins
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations83
US11545562B2Jan 3, 2023
Source and drain structure with reduced contact resistance and enhanced mobility
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10163650B2Dec 25, 2018
System and method for selective nitride etch
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11600713B2Mar 7, 2023
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10734246B2Aug 4, 2020
Heat shield for chamber door and devices manufactured using same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US12424568B2Sep 23, 2025
Method for forming recesses in a substrate by etching dummy fins
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002855B2Jun 4, 2024
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11522050B2Dec 6, 2022
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11488912B2Nov 1, 2022
Method for forming recesses in a substrate by etching dummy fins
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300741B2May 13, 2025
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12125707B2Oct 22, 2024
Fin field-effect transistor device and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12015085B2Jun 18, 2024
Method of manufacturing a semiconductor device including etching polysilicon
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11532481B2Dec 20, 2022
Fin field-effect transistor device and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11430893B2Aug 30, 2022
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12074032B2Aug 27, 2024
Heat shield for chamber door and devices manufactured using same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11031252B2Jun 8, 2021
Heat shield for chamber door and devices manufactured using same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11120986B2Sep 14, 2021
Etching using chamber with top plate formed of non-oxygen containing material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10504720B2Dec 10, 2019
Etching using chamber with top plate formed of non-oxygen containing material
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US12432955B2Sep 30, 2025
Source and drain structure with reduced contact resistance and enhanced mobility
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9391072B2Jul 12, 2016
Sacrificial oxide with uniform thickness
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9136109B2Sep 15, 2015
Sacrificial oxide with uniform thickness
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10861800B2Dec 8, 2020
Integrated circuit structure having a crown-shaped semiconductor strip and an isolation region recessed in the substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10825739B2Nov 3, 2020
FinFET devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10510615B2Dec 17, 2019
FinFET devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9721805B1Aug 1, 2017
Formation method of semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations49
US10032661B2Jul 24, 2018
Semiconductor device, method, and tool of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations45
US10269938B2Apr 23, 2019
Semiconductor device structure having a doped passivation layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations39
US10163642B2Dec 25, 2018
Semiconductor device, method and tool of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations37
US9543410B2Jan 10, 2017
Semiconductor device and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations36