P

Inventor

ELKANOVICH IGOR

TW23 patents
⚠️ This page may combine multiple inventors who share the name “ELKANOVICH IGOR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBAL UNICHIP CORP

20 patents
US11474554B2Oct 18, 2022

Circuit for providing clock to de-serializer in communication physical layer

GLOBAL UNICHIP CORP3 citations71
US11411560B1Aug 9, 2022

Electronic system, integrated circuit die and operation method thereof

GLOBAL UNICHIP CORP5 citations71
US11031923B1Jun 8, 2021

Interface device and interface method for 3D semiconductor device

GLOBAL UNICHIP CORP2 citations71
US11063596B1Jul 13, 2021

Frame decoding circuit and method for performing frame decoding

GLOBAL UNICHIP CORP4 citations70
US11336427B1May 17, 2022

Circuit of communication interface between two dies and method to manage communication interface

GLOBAL UNICHIP CORP3 citations68
US11699683B2Jul 11, 2023

Semiconductor device in 3D stack with communication interface and managing method thereof

GLOBAL UNICHIP CORP0 citations61
US11144485B1Oct 12, 2021

Interface for semiconductor device with symmetric bond pattern and method for arranging interface thereof

GLOBAL UNICHIP CORP0 citations61
US11515278B2Nov 29, 2022

Communication interface structure between processing die and memory die

GLOBAL UNICHIP CORP1 citations56
US12438654B2Oct 7, 2025

Communication system between dies and repairing method for lanes between dies

GLOBAL UNICHIP CORP0 citations51
US12292850B2May 6, 2025

Communication system between dies and operation method thereof

GLOBAL UNICHIP CORP0 citations51
US12093202B2Sep 17, 2024

DBI encoding device and DBI encoding method

GLOBAL UNICHIP CORP0 citations51
US12235717B2Feb 25, 2025

Communication system between dies and operation method thereof

GLOBAL UNICHIP CORP0 citations50
US11687472B2Jun 27, 2023

Interface for semiconductor device and interfacing method thereof

GLOBAL UNICHIP CORP0 citations50
US11675731B2Jun 13, 2023

Data protection system and method thereof for 3D semiconductor device

GLOBAL UNICHIP CORP0 citations50
US12066968B2Aug 20, 2024

Communication interface structure and Die-to-Die package

GLOBAL UNICHIP CORP0 citations48
US12283957B2Apr 22, 2025

Interface device and signal transceiving method thereof

GLOBAL UNICHIP CORP0 citations47
US12117864B2Oct 15, 2024

Interface device and signal transceiving method thereof

GLOBAL UNICHIP CORP0 citations47
US11742295B2Aug 29, 2023

Interface of integrated circuit die and method for arranging interface thereof

GLOBAL UNICHIP CORP0 citations47
US11902171B2Feb 13, 2024

Communication system between dies and operation method thereof

GLOBAL UNICHIP CORP0 citations46
US11600572B2Mar 7, 2023

Routing structure between dies and method for arranging routing between dies

GLOBAL UNICHIP CORP0 citations44

DVIR AMIAD

1 patent

BROADLIGHT LTD

1 patent

SITTON GAL

1 patent