Inventor
ELKANOVICH IGOR
TW23 patents
⚠️ This page may combine multiple inventors who share the name “ELKANOVICH IGOR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBAL UNICHIP CORP
20 patentsUS11474554B2Oct 18, 2022
Circuit for providing clock to de-serializer in communication physical layer
GLOBAL UNICHIP CORP3 citations71
US11411560B1Aug 9, 2022
Electronic system, integrated circuit die and operation method thereof
GLOBAL UNICHIP CORP5 citations71
US11031923B1Jun 8, 2021
Interface device and interface method for 3D semiconductor device
GLOBAL UNICHIP CORP2 citations71
US11063596B1Jul 13, 2021
Frame decoding circuit and method for performing frame decoding
GLOBAL UNICHIP CORP4 citations70
US11336427B1May 17, 2022
Circuit of communication interface between two dies and method to manage communication interface
GLOBAL UNICHIP CORP3 citations68
US11699683B2Jul 11, 2023
Semiconductor device in 3D stack with communication interface and managing method thereof
GLOBAL UNICHIP CORP0 citations61
US11144485B1Oct 12, 2021
Interface for semiconductor device with symmetric bond pattern and method for arranging interface thereof
GLOBAL UNICHIP CORP0 citations61
US11515278B2Nov 29, 2022
Communication interface structure between processing die and memory die
GLOBAL UNICHIP CORP1 citations56
US12438654B2Oct 7, 2025
Communication system between dies and repairing method for lanes between dies
GLOBAL UNICHIP CORP0 citations51
US12292850B2May 6, 2025
Communication system between dies and operation method thereof
GLOBAL UNICHIP CORP0 citations51
US12093202B2Sep 17, 2024
DBI encoding device and DBI encoding method
GLOBAL UNICHIP CORP0 citations51
US12235717B2Feb 25, 2025
Communication system between dies and operation method thereof
GLOBAL UNICHIP CORP0 citations50
US11687472B2Jun 27, 2023
Interface for semiconductor device and interfacing method thereof
GLOBAL UNICHIP CORP0 citations50
US11675731B2Jun 13, 2023
Data protection system and method thereof for 3D semiconductor device
GLOBAL UNICHIP CORP0 citations50
US12066968B2Aug 20, 2024
Communication interface structure and Die-to-Die package
GLOBAL UNICHIP CORP0 citations48
US12283957B2Apr 22, 2025
Interface device and signal transceiving method thereof
GLOBAL UNICHIP CORP0 citations47
US12117864B2Oct 15, 2024
Interface device and signal transceiving method thereof
GLOBAL UNICHIP CORP0 citations47
US11742295B2Aug 29, 2023
Interface of integrated circuit die and method for arranging interface thereof
GLOBAL UNICHIP CORP0 citations47
US11902171B2Feb 13, 2024
Communication system between dies and operation method thereof
GLOBAL UNICHIP CORP0 citations46
US11600572B2Mar 7, 2023
Routing structure between dies and method for arranging routing between dies
GLOBAL UNICHIP CORP0 citations44