Inventor

JEONG SEONGWON

KR3 patents

Patents

3 patents

US11784139B2Oct 10, 2023

Package substrate and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations56

US11342283B2May 24, 2022

Package substrate and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations56

US11640950B2May 2, 2023

Semiconductor chip and semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations51