Inventor
KOYAMA TETSUYA
JP21 patents
⚠️ This page may combine multiple inventors who share the name “KOYAMA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
13 patentsUS7989707B2Aug 2, 2011
Chip embedded substrate and method of producing the same
SHINKO ELECTRIC IND CO71 citations97
US7884484B2Feb 8, 2011
Wiring board and method of manufacturing the same
SHINKO ELECTRIC IND CO24 citations92
US7501696B2Mar 10, 2009
Semiconductor chip-embedded substrate and method of manufacturing same
SHINKO ELECTRIC IND CO30 citations92
US9137900B2Sep 15, 2015
Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate
SHINKO ELECTRIC IND CO15 citations84
US7882627B2Feb 8, 2011
Method of manufacturing a multilayer wiring board
SHINKO ELECTRIC IND CO7 citations84
US7955454B2Jun 7, 2011
Method for forming wiring on insulating resin layer
SHINKO ELECTRIC IND CO8 citations80
US7772689B2Aug 10, 2010
Semiconductor package with a conductive post and wiring pattern
SHINKO ELECTRIC IND CO7 citations74
US9257386B2Feb 9, 2016
Wiring substrate and semiconductor device
SHINKO ELECTRIC IND CO6 citations72
US7847384B2Dec 7, 2010
Semiconductor package and manufacturing method thereof
SHINKO ELECTRIC IND CO6 citations63
US10134680B2Nov 20, 2018
Electronic part embedded substrate and method of producing an electronic part embedded substrate
SHINKO ELECTRIC IND CO0 citations52
US9768122B2Sep 19, 2017
Electronic part embedded substrate and method of producing an electronic part embedded substrate
SHINKO ELECTRIC IND CO0 citations52
US9451702B2Sep 20, 2016
Chip embedded substrate and method of producing the same
SHINKO ELECTRIC IND CO0 citations52
US9059088B2Jun 16, 2015
Electronic component built-in substrate
SHINKO ELECTRIC IND CO0 citations36