Inventor
PEDERSEN DAVID V
US53 patents
⚠️ This page may combine multiple inventors who share the name “PEDERSEN DAVID V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FORMFACTOR INC
38 patentsUS6825052B2Nov 30, 2004
Test assembly including a test die for testing a semiconductor product die
FORMFACTOR INC114 citations99
US6788094B2Sep 7, 2004
Wafer-level burn-in and test
FORMFACTOR INC95 citations99
US6690185B1Feb 10, 2004
Large contactor with multiple, aligned contactor units
FORMFACTOR INC268 citations99
US6621260B2Sep 16, 2003
Special contact points for accessing internal circuitry of an integrated circuit
FORMFACTOR INC98 citations99
US6597187B2Jul 22, 2003
Special contact points for accessing internal circuitry of an integrated circuit
FORMFACTOR INC99 citations99
US6551844B1Apr 22, 2003
Test assembly including a test die for testing a semiconductor product die
FORMFACTOR INC109 citations99
US6534856B1Mar 18, 2003
Sockets for “springed” semiconductor devices
FORMFACTOR INC138 citations99
US6525555B1Feb 25, 2003
Wafer-level burn-in and test
FORMFACTOR INC164 citations99
US6456099B1Sep 24, 2002
Special contact points for accessing internal circuitry of an integrated circuit
FORMFACTOR INC183 citations99
US6429029B1Aug 6, 2002
Concurrent design and subsequent partitioning of product and test die
FORMFACTOR INC215 citations99
US6330164B1Dec 11, 2001
Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device
FORMFACTOR INC196 citations99
US6232149B1May 15, 2001
Sockets for “springed” semiconductor devices
FORMFACTOR INC98 citations99
US6184053B1Feb 6, 2001
Method of making microelectronic spring contact elements
FORMFACTOR INC372 citations99
US6064213AMay 16, 2000
Wafer-level burn-in and test
FORMFACTOR INC416 citations99
US6043563AMar 28, 2000
Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals
FORMFACTOR INC294 citations99
US6033935AMar 7, 2000
Sockets for "springed" semiconductor devices
FORMFACTOR INC174 citations99
US5998864ADec 7, 1999
Stacking semiconductor devices, particularly memory chips
FORMFACTOR INC311 citations99
US6727580B1Apr 27, 2004
Microelectronic spring contact elements
FORMFACTOR INC102 citations98
US6664628B2Dec 16, 2003
Electronic component overlapping dice of unsingulated semiconductor wafer
FORMFACTOR INC80 citations98
US6644982B1Nov 11, 2003
Method and apparatus for the transport and tracking of an electronic component
FORMFACTOR INC173 citations98
US6627483B2Sep 30, 2003
Method for mounting an electronic component
FORMFACTOR INC155 citations98
US6603324B2Aug 5, 2003
Special contact points for accessing internal circuitry of an integrated circuit
FORMFACTOR INC84 citations98
US6215196B1Apr 10, 2001
Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals
FORMFACTOR INC94 citations98
US6640415B2Nov 4, 2003
Segmented contactor
FORMFACTOR INC166 citations97
US7078926B2Jul 18, 2006
Wafer-level burn-in and test
FORMFACTOR INC44 citations96
US6940093B2Sep 6, 2005
Special contact points for accessing internal circuitry of an integrated circuit
FORMFACTOR INC30 citations96
US7714235B1May 11, 2010
Lithographically defined microelectronic contact structures
FORMFACTOR INC28 citations93
US7557596B2Jul 7, 2009
Test assembly including a test die for testing a semiconductor product die
FORMFACTOR INC24 citations93
US7345493B2Mar 18, 2008
Wafer-level burn-in and test
FORMFACTOR INC21 citations93
US7202677B2Apr 10, 2007
Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
FORMFACTOR INC19 citations93
US7217580B2May 15, 2007
Method for processing an integrated circuit
FORMFACTOR INC22 citations92
US7059047B2Jun 13, 2006
Sockets for “springed” semiconductor devices
FORMFACTOR INC15 citations92
US7534654B2May 19, 2009
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
FORMFACTOR INC10 citations84
US7578057B2Aug 25, 2009
Method of fabricating segmented contactor
FORMFACTOR INC6 citations72
US7215131B1May 8, 2007
Segmented contactor
FORMFACTOR INC6 citations72
US7065870B2Jun 27, 2006
Segmented contactor
FORMFACTOR INC5 citations72
US7688090B2Mar 30, 2010
Wafer-level burn-in and test
FORMFACTOR INC2 citations63
US7579269B2Aug 25, 2009
Microelectronic spring contact elements
FORMFACTOR INC5 citations63
CUBIC MEMORY INC
9 patentsUS5675180AOct 7, 1997
Vertical interconnect process for silicon segments
CUBIC MEMORY INC172 citations98
US5661087AAug 26, 1997
Vertical interconnect process for silicon segments
CUBIC MEMORY INC104 citations98
US6134118AOct 17, 2000
Conductive epoxy flip-chip package and method
CUBIC MEMORY INC73 citations96
US5837566ANov 17, 1998
Vertical interconnect process for silicon segments
CUBIC MEMORY INC56 citations96
US5698895ADec 16, 1997
Silicon segment programming method and apparatus
CUBIC MEMORY INC70 citations96
US5657206AAug 12, 1997
Conductive epoxy flip-chip package and method
CUBIC MEMORY INC73 citations96
US6188126B1Feb 13, 2001
Vertical interconnect process for silicon segments
CUBIC MEMORY INC20 citations92
US5994170ANov 30, 1999
Silicon segment programming method
CUBIC MEMORY INC19 citations92
US5936302AAug 10, 1999
Speaker diaphragm
CUBIC MEMORY INC27 citations92
CORELOGIC SOLUTIONS LLC
2 patentsVERTICAL CIRCUITS INC
1 patentShowing the top 50 of 53 patents by PatentIndex Score.