Inventor

CHEN YI-HSIU

TW48 patents

⚠️ This page may combine multiple inventors who share the name “CHEN YI-HSIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN YI-HSIU

TAIWAN SEMICONDUCTOR MFG CO LTD

Dummy structure for chip-on-wafer-on-substrate

Forming a cavity with a wet etch for backside contact formation

Die stack structure and method of fabricating the same

Etch method with surface modification treatment for forming semiconductor structure

Bond structures and the methods of forming the same

Three dimensional integrated circuit structure and manufacturing method of the same

Chip-stacking apparatus having a transport device configured to transport a chip onto a substrate

Forming a cavity with a wet etch for backside contact formation

Passivation structure with planar top surfaces

Method of manufacturing semiconductor package structure

Die structure, die stack structure and method of fabricating the same

Method of manufacturing semiconductor package structure

Semiconductor device and method

Semiconductor device and method

Bond structures and the methods of forming the same

Semiconductor device and method

Dummy structure for chip-on-wafer-on-substrate

Semiconductor device and method

Passivation structure with planar top surfaces

Semiconductor device and method

Method of manufacturing semiconductor package structure

Through via structure extending to metallization layer

Through-substrate via formation with improved topography control

Self-aligned patterning layer for metal gate formation

Transistor device for source/drain backside contact and method of forming cavity

Package structure and method of forming the same

Three-dimensional integrated circuit structure and method of manufacturing the same

Integrated circuit packages and methods of forming the same

Formation of self-assembled monolayer for selective etching process

Bond structures and the methods of forming the same

Gap filling method in semiconductor manufacturing process

WINBOND ELECTRONICS CORP

Resistive random access memory and method for forming the same

Resistive random access memory

Resistive random access memory

Resistive random access memory device and manufacturing method thereof

Resisitive random access memory structure and method for forming the same

Manufacturing method of resistive random access memory device

Resistive random-access memory structure and method for fabricating the same

TAIWAN SEMICONDUCTOR MFG

Through substrate via structures and methods of forming the same

Through-substrate via formation with improved topography control

UNITED MICROELECTRONICS CORP

Semiconductor device and method for fabricating the same

Method of copper hillock detecting

YANG KU-FENG

Through substrate via structures and methods of forming the same

COINBASE INC

Publicly verifiable encryption

HTC CORP

Virtual reality device and method for virtual reality

AKAOGI TAKAO

Non-volatile memory having discrete isolation structure and SONOS memory cell, method of operating the same, and method of manufacturing the same

EON SILICON SOLUTIONS INC

Method of manufacturing the double-implant nor flash memory structure

CHEN YI-HSIU

Method of manufacturing non-volatile memory cell using self-aligned metal silicide