Inventor
PERLMAN DAVID J
US13 patents
⚠️ This page may combine multiple inventors who share the name “PERLMAN DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS5567654AOct 22, 1996
Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
IBM150 citations99
US5478781ADec 26, 1995
Polyimide-insulated cube package of stacked semiconductor device chips
IBM174 citations99
US7234099B2Jun 19, 2007
High reliability memory module with a fault tolerant address and command bus
IBM114 citations98
US5532519AJul 2, 1996
Cube wireability enhancement with chip-to-chip alignment and thickness control
IBM70 citations96
US5414637AMay 9, 1995
Intra-module spare routing for high density electronic packages
IBM57 citations96
US5229639AJul 20, 1993
Low powder distribution inductance lead frame for semiconductor chips
IBM62 citations94
US7363533B2Apr 22, 2008
High reliability memory module with a fault tolerant address and command bus
IBM10 citations92
US5567653AOct 22, 1996
Process for aligning etch masks on an integrated circuit surface using electromagnetic energy
IBM31 citations92
US4341942AJul 27, 1982
Method of bonding wires to passivated chip microcircuit conductors
IBM36 citations89
US7761771B2Jul 20, 2010
High reliability memory module with a fault tolerant address and command bus
IBM7 citations73
US5297091AMar 22, 1994
Early row address strobe (RAS) precharge
IBM11 citations72
US4196389AApr 1, 1980
Test site for a charged coupled device (CCD) array
IBM6 citations57