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Inventor

WANG ALAN E

US35 patents
⚠️ This page may combine multiple inventors who share the name “WANG ALAN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PPG IND OHIO INC

21 patents
US6477926B1Nov 12, 2002

Polishing pad

PPG IND OHIO INC120 citations97
US7291063B2Nov 6, 2007

Polyurethane urea polishing pad

PPG IND OHIO INC29 citations92
US6905402B2Jun 14, 2005

Polishing pad for planarization

PPG IND OHIO INC33 citations92
US6844504B2Jan 18, 2005

Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

PPG IND OHIO INC28 citations92
US6074761AJun 13, 2000

Inkjet printing media

PPG IND OHIO INC16 citations92
US7157119B2Jan 2, 2007

Method and compositions for applying multiple overlying organic pigmented decorations on ceramic substrates

PPG IND OHIO INC22 citations89
US7000313B2Feb 21, 2006

Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions

PPG IND OHIO INC12 citations84
US6214414B1Apr 10, 2001

Method for forming a sequence of crosslinked pigmented coatings on ceramic substrates

PPG IND OHIO INC19 citations81
US7690103B2Apr 6, 2010

Method of forming a printed circuit board with improved via design

PPG IND OHIO INC6 citations74
US7002081B2Feb 21, 2006

Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

PPG IND OHIO INC8 citations74
US6951707B2Oct 4, 2005

Process for creating vias for circuit assemblies

PPG IND OHIO INC10 citations74
US6824959B2Nov 30, 2004

Process for creating holes in polymeric substrates

PPG IND OHIO INC8 citations74
US7097549B2Aug 29, 2006

Polishing pad

PPG IND OHIO INC9 citations73
US6713587B2Mar 30, 2004

Electrodepositable dielectric coating compositions and methods related thereto

PPG IND OHIO INC11 citations73
US5998534ADec 7, 1999

Water-soluble or water-dispersible addition copolymer

PPG IND OHIO INC9 citations73
US8008188B2Aug 30, 2011

Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials

PPG IND OHIO INC2 citations63
US7743494B2Jun 29, 2010

Process of fabricating a circuit board

PPG IND OHIO INC4 citations63
US7679001B2Mar 16, 2010

Circuit board and method of manufacture thereof

PPG IND OHIO INC2 citations63
US7159308B2Jan 9, 2007

Method of making a circuit board

PPG IND OHIO INC1 citations63
US7485812B2Feb 3, 2009

Single or multi-layer printed circuit board with improved via design

PPG IND OHIO INC4 citations61
US7228623B2Jun 12, 2007

Process for fabricating a multi layer circuit assembly

PPG IND OHIO INC0 citations52

PPG INDUSTRIES INC

5 patents

BASF CORP

2 patents

UNION CARBIDE CORP

2 patents

OLSON KEVIN C

2 patents

HEWLETT PACKARD CO

1 patent

UNION CARBIDE CHEM PLASTIC

1 patent

WANG ALAN E

1 patent