Inventor
HIGASHI MICHIYA
JP10 patents
Patents
10 patentsUS5536970AJul 16, 1996
Resin-encapsulated semiconductor device
TOSHIBA KK80 citations94
US4719502AJan 12, 1988
Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used
TOSHIBA KK59 citations94
US5272377ADec 21, 1993
Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
TOSHIBA KK34 citations92
US5258426ANov 2, 1993
Semiconductor device encapsulant
TOSHIBA KK29 citations92
US5145889ASep 8, 1992
Acid anhydride-cured epoxy resin encapsulant with triorganothiophosphite
TOSHIBA KK38 citations92
US5057457AOct 15, 1991
Multimold semiconductor device and the manufacturing method therefor
TOSHIBA KK36 citations87
US4719255AJan 12, 1988
Epoxy resin composition for encapsulation of semi-conductor device
TOSHIBA KK22 citations81
US4710796ADec 1, 1987
Resin encapsulation type semiconductor device by use of epoxy resin composition
TOSHIBA KK22 citations81
US5346743ASep 13, 1994
Resin encapsulation type semiconductor device
TOSHIBA KK17 citations73
US5068267ANov 26, 1991
Semiconductor device encapsulant consisting of epoxy resin composition
TOSHIBA KK17 citations70