Inventor

LEE YUNG-CHENG

US26 patents

⚠️ This page may combine multiple inventors who share the name “LEE YUNG-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE YUNG-CHENG

KELVIN THERMAL TECH INC

Flexible thermal ground plane and manufacturing the same

Flexible thermal ground plane and manufacturing the same

Micropillar-enabled thermal ground plane

Thermal ground plane

Thermal ground plane

Method and device for spreading high heat fluxes in thermal ground planes

Polymer-based microfabricated thermal ground plane

Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems

Thermal management planes

Micropillar-enabled thermal ground plane

Folding thermal ground plane

Thermal ground plane

Thermal management planes

Polymer-based microfabricated thermal ground plane

Micropillar-enabled thermal ground plane

Folding thermal ground plane

UNIV COLORADO REGENTS

Single and multi-layer mesh structures for enhanced thermal transport

Single and multi-layer mesh structures for enhanced thermal transport

Single and multi-layer mesh structures for enhanced thermal transport

UNIV COLORADO

Spatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioning

Atomic layer deposition on micro-mechanical devices

AT & T BELL LAB

Article comprising a stacked array of electronic subassemblies

YANG RONGGUI

Flexible thermal ground plane and manufacturing the same

RAYTHEON CO

Mechanically improved microelectronic thermal interface structure for low die stress

I2C SOLUTIONS LLC

Conformal thermal ground planes

ROCCOR LLC

Conformal thermal ground planes