Inventor
ACOCELLA JOHN
US15 patents
⚠️ This page may combine multiple inventors who share the name “ACOCELLA JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
14 patentsUS5591941AJan 7, 1997
Solder ball interconnected assembly
IBM183 citations96
US4747907AMay 31, 1988
Metal etching process with etch rate enhancement
IBM59 citations96
US5294830AMar 15, 1994
Apparatus for indirect impingement cooling of integrated circuit chips
IBM99 citations95
US5108541AApr 28, 1992
Processes for electrically conductive decals filled with inorganic insulator material
IBM67 citations95
US6504105B1Jan 7, 2003
Solder ball connections and assembly process
IBM44 citations93
US5675889AOct 14, 1997
Solder ball connections and assembly process
IBM77 citations93
US5139851AAug 18, 1992
Low dielectric composite substrate
IBM22 citations92
US5031029AJul 9, 1991
Copper device and use thereof with semiconductor devices
IBM28 citations92
US4879156ANov 7, 1989
Multilayered ceramic substrate having solid non-porous metal conductors
IBM38 citations92
US4753694AJun 28, 1988
Process for forming multilayered ceramic substrate having solid metal conductors
IBM49 citations92
US5338900AAug 16, 1994
Structures for electrically conductive decals filled with inorganic insulator material
IBM55 citations91
US5135595AAug 4, 1992
Process for fabricating a low dielectric composite substrate
IBM24 citations91
US5277725AJan 11, 1994
Process for fabricating a low dielectric composite substrate
IBM17 citations81
US5167913ADec 1, 1992
Method of forming an adherent layer of metallurgy on a ceramic substrate
IBM6 citations62