Inventor
HOEBENER KARL GRANT
US5 patents
Patents
5 patentsUS5758413AJun 2, 1998
Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias
IBM159 citations94
US5699613ADec 23, 1997
Fine dimension stacked vias for a multiple layer circuit board structure
IBM200 citations94
US6504105B1Jan 7, 2003
Solder ball connections and assembly process
IBM44 citations93
US5675889AOct 14, 1997
Solder ball connections and assembly process
IBM77 citations93
US5825629AOct 20, 1998
Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment
IBM37 citations84