Inventor
SHERIF RAED A
US26 patents
⚠️ This page may combine multiple inventors who share the name “SHERIF RAED A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
24 patentsUS6330157B1Dec 11, 2001
Variable thermal exchanger and method thereof
IBM83 citations98
US6218730B1Apr 17, 2001
Apparatus for controlling thermal interface gap distance
IBM88 citations98
US5990418ANov 23, 1999
Hermetic CBGA/CCGA structure with thermal paste cooling
IBM156 citations97
US5623394AApr 22, 1997
Apparatus for cooling of chips using a plurality of customized thermally conductive materials
IBM121 citations97
US5239443AAug 24, 1993
Blind hole cold plate cooling system
IBM138 citations97
US6294408B1Sep 25, 2001
Method for controlling thermal interface gap distance
IBM156 citations96
US5881945AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates and process
IBM57 citations96
US5881944AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates
IBM53 citations96
US5981310ANov 9, 1999
Multi-chip heat-sink cap assembly
IBM59 citations95
US5706171AJan 6, 1998
Flat plate cooling using a thermal paste retainer
IBM53 citations95
US5604978AFeb 25, 1997
Method for cooling of chips using a plurality of materials
IBM67 citations95
US5819402AOct 13, 1998
Method for cooling of chips using blind holes with customized depth
IBM63 citations94
US5757620AMay 26, 1998
Apparatus for cooling of chips using blind holes with customized depth
IBM50 citations94
US5724729AMar 10, 1998
Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials
IBM71 citations94
US6373133B1Apr 16, 2002
Multi-chip module and heat-sink cap combination
IBM34 citations92
US6255139B1Jul 3, 2001
Method for providing a thermal path through particles embedded in a thermal cap
IBM19 citations92
US6111314AAug 29, 2000
Thermal cap with embedded particles
IBM23 citations92
US5891755AApr 6, 1999
Process for flat plate cooling a semiconductor chip using a thermal paste retainer
IBM31 citations92
US6459160B1Oct 1, 2002
Package with low stress hermetic seal
IBM19 citations90
US6333460B1Dec 25, 2001
Structural support for direct lid attach
IBM18 citations84
US6342407B1Jan 29, 2002
Low stress hermetic seal
IBM15 citations82
US6049456AApr 11, 2000
Electronic module adjustment design and process using shims
IBM12 citations73
US5977625ANov 2, 1999
Semiconductor package with low strain seal
IBM2 citations61
US5723905AMar 3, 1998
Semiconductor package with low strain seal
IBM1 citations51