Inventor
EDWARDS DAVID LINN
US7 patents
Patents
7 patentsUS5706171AJan 6, 1998
Flat plate cooling using a thermal paste retainer
IBM53 citations95
US5819402AOct 13, 1998
Method for cooling of chips using blind holes with customized depth
IBM63 citations94
US5757620AMay 26, 1998
Apparatus for cooling of chips using blind holes with customized depth
IBM50 citations94
US5724729AMar 10, 1998
Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials
IBM71 citations94
US5891755AApr 6, 1999
Process for flat plate cooling a semiconductor chip using a thermal paste retainer
IBM31 citations92
US5977625ANov 2, 1999
Semiconductor package with low strain seal
IBM2 citations61
US5723905AMar 3, 1998
Semiconductor package with low strain seal
IBM1 citations51