Inventor

IRUVANTI SUSHUMNA

US61 patents

⚠️ This page may combine multiple inventors who share the name “IRUVANTI SUSHUMNA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IRUVANTI SUSHUMNA

IBM

Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

Direct chip-cooling through liquid vaporization heat exchange

Hermetic CBGA/CCGA structure with thermal paste cooling

Apparatus for cooling of chips using a plurality of customized thermally conductive materials

Method for controlling thermal interface gap distance

Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

Multi-layer solder seal band for semiconductor substrates

Multi-layer solder seal band for semiconductor substrates and process

Multi-chip heat-sink cap assembly

Integral mesh flat plate cooling module

Flat plate cooling using a thermal paste retainer

Method for cooling of chips using a plurality of materials

Method for cooling of chips using blind holes with customized depth

Integral mesh flat plate cooling method

Apparatus for cooling of chips using blind holes with customized depth

Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials

Reworkable polymer chip encapsulant

Patterned metal thermal interface

Thermal paste containment for semiconductor modules

Polyester dispersants for high thermal conductivity paste

Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package

Thermal pillow

Multi-chip module and heat-sink cap combination

Method for providing a thermal path through particles embedded in a thermal cap

Thermal cap with embedded particles

Process for flat plate cooling a semiconductor chip using a thermal paste retainer

Reworkable polymer chip encapsulant

Polyester dispersants for high thermal conductivity paste

Thermal paste for low temperature applications

Thermal paste containment for semiconductor modules

Method and package for circuit chip packaging

Method for bonding heatsink to multiple-height chip

Laminated stiffener to control the warpage of electronic chip carriers

Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip

Heterogeneous thermal interface material for corner and or edge degradation mitigation

Method and device including reworkable alpha particle barrier and corrosion barrier

Localized catalyst for enhanced thermal interface material heat transfer

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

Reduction of laminate failure in integrated circuit (IC) device carrier

Reversible thermal thickening grease

Multi chip hardware security module

Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers

Conformal integrated circuit (IC) device package lid

Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers

IRUVANTI SUSHUMNA

Method and package for circuit chip packaging

High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites

RES FOUNDATION OF STATE UNIV O

Stable high solids, high thermal conductivity pastes

EDWARDS DAVID L

Thermal paste containment for semiconductor modules

FURMAN BRUCE K

Patterned metal thermal interface