Inventor
HSU HSING-CHOU
TW9 patents
⚠️ This page may combine multiple inventors who share the name “HSU HSING-CHOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VIA TECH INC
5 patentsUS7615708B2Nov 10, 2009
Arrangement of non-signal through vias and wiring board applying the same
VIA TECH INC9 citations78
US7291916B2Nov 6, 2007
Signal transmission structure and circuit substrate thereof
VIA TECH INC9 citations72
US7279913B2Oct 9, 2007
Testing assembly for electrical test of electronic package and testing socket thereof
VIA TECH INC3 citations60
US7586320B2Sep 8, 2009
Plunger and chip-testing module applying the same
VIA TECH INC0 citations48
US7449788B2Nov 11, 2008
Chip structure with arrangement of side pads
VIA TECH INC0 citations46
HSU HSING-CHOU
4 patentsUS8120441B2Feb 21, 2012
Circuit board with a reference plane having multi-part non-conductive regions for decreased crosstalk
HSU HSING-CHOU3 citations59
US8332804B2Dec 11, 2012
Impedance design method
HSU HSING-CHOU0 citations48
US8151241B2Apr 3, 2012
Impedance design method
HSU HSING-CHOU0 citations48
US8204731B2Jun 19, 2012
Signal analyzing method for electronic device having on-chip network and off-chip network
HSU HSING-CHOU0 citations38