P

Inventor

YAGI HIROSHI

JP130 patents
⚠️ This page may combine multiple inventors who share the name “YAGI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TERUMO CORP

15 patents

DAINIPPON PRINTING CO LTD

13 patents
US6201292B1Mar 13, 2001

Resin-sealed semiconductor device, circuit member used therefor

DAINIPPON PRINTING CO LTD300 citations98
US6025640AFeb 15, 2000

Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device

DAINIPPON PRINTING CO LTD317 citations97
US6872893B2Mar 29, 2005

Wiring board provided with passive element and cone shaped bumps

DAINIPPON PRINTING CO LTD59 citations96
US6359221B1Mar 19, 2002

Resin sealed semiconductor device, circuit member for use therein

DAINIPPON PRINTING CO LTD92 citations96
US6133070AOct 17, 2000

Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them

DAINIPPON PRINTING CO LTD58 citations96
US6942817B2Sep 13, 2005

Method of manufacturing wireless suspension blank

DAINIPPON PRINTING CO LTD60 citations95
US7307347B2Dec 11, 2007

Resin-encapsulated package, lead member for the same and method of fabricating the lead member

DAINIPPON PRINTING CO LTD14 citations93
US6828688B2Dec 7, 2004

Resin-sealed semiconductor device, circuit member used for the device, and method of manufacturing the circuit member

DAINIPPON PRINTING CO LTD15 citations93
US7112287B2Sep 26, 2006

Thin film supporting substrate for used in filter for hydrogen production filter and method for manufacturing filter for hydrogen production

DAINIPPON PRINTING CO LTD20 citations92
US6774470B2Aug 10, 2004

Non-contact data carrier and method of fabricating the same

DAINIPPON PRINTING CO LTD34 citations92
US6465734B2Oct 15, 2002

Resin sealed semiconductor device, circuit member for use therein and method of manufacturing circuit member

DAINIPPON PRINTING CO LTD15 citations91
US7679925B2Mar 16, 2010

Method for fabricating wiring board provided with passive element, and wiring board provided with passive element

DAINIPPON PRINTING CO LTD10 citations84
US7857874B2Dec 28, 2010

Micro-reactor and method of manufacturing the same

DAINIPPON PRINTING CO LTD8 citations83

TDK CORP

5 patents

GLOBERIDE INC

3 patents

WADA SATOSHI

2 patents

SEGA ENTERPRISES KK

2 patents

(unassigned)

1 patent

SEGA CORP

1 patent

ELCO CO LTD

1 patent

DAIWA SEIKO INC

1 patent

CHIYODA CHEM ENG CONSTRUCT CO

1 patent

DAIKIN IND LTD

1 patent

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

1 patent

D T CIRCUIT TECHNOLOGY CO LTD

1 patent

FUJIMAGARI HIDEKI

1 patent

AGENCY IND SCIENCE TECHN

1 patent

Showing the top 50 of 130 patents by PatentIndex Score.