Inventor
YAGI HIROSHI
JP130 patents
⚠️ This page may combine multiple inventors who share the name “YAGI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TERUMO CORP
15 patentsUS7498477B2Mar 3, 2009
Hemostatic device
TERUMO CORP96 citations99
US9895155B2Feb 20, 2018
Method to stop bleeding at a puncture site
TERUMO CORP28 citations98
US8759603B2Jun 24, 2014
Hemostatic device
TERUMO CORP43 citations98
US8524974B2Sep 3, 2013
Hemostatic device
TERUMO CORP44 citations98
US8481805B2Jul 9, 2013
Method to stop bleeding at a puncture site of an artery of a patient's wrist
TERUMO CORP51 citations98
US7331966B2Feb 19, 2008
Device for introduction of long item
TERUMO CORP69 citations97
US9936959B2Apr 10, 2018
Hemostatic device
TERUMO CORP7 citations92
US10856898B2Dec 8, 2020
Foreign object removal device
TERUMO CORP32 citations91
USD611601SMar 9, 2010
Guide wire for catheter
TERUMO CORP40 citations90
US11406395B2Aug 9, 2022
Hemostatic device
TERUMO CORP5 citations84
US10610238B2Apr 7, 2020
Hemostatic device
TERUMO CORP2 citations84
US10219809B2Mar 5, 2019
Hemostatic device
TERUMO CORP6 citations84
US10058334B1Aug 28, 2018
Method to stop bleeding
TERUMO CORP3 citations84
US9949741B2Apr 24, 2018
Hemostatic device
TERUMO CORP7 citations84
US7708744B2May 4, 2010
Device for introduction of long item
TERUMO CORP9 citations83
DAINIPPON PRINTING CO LTD
13 patentsUS6201292B1Mar 13, 2001
Resin-sealed semiconductor device, circuit member used therefor
DAINIPPON PRINTING CO LTD300 citations98
US6025640AFeb 15, 2000
Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device
DAINIPPON PRINTING CO LTD317 citations97
US6872893B2Mar 29, 2005
Wiring board provided with passive element and cone shaped bumps
DAINIPPON PRINTING CO LTD59 citations96
US6359221B1Mar 19, 2002
Resin sealed semiconductor device, circuit member for use therein
DAINIPPON PRINTING CO LTD92 citations96
US6133070AOct 17, 2000
Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them
DAINIPPON PRINTING CO LTD58 citations96
US6942817B2Sep 13, 2005
Method of manufacturing wireless suspension blank
DAINIPPON PRINTING CO LTD60 citations95
US7307347B2Dec 11, 2007
Resin-encapsulated package, lead member for the same and method of fabricating the lead member
DAINIPPON PRINTING CO LTD14 citations93
US6828688B2Dec 7, 2004
Resin-sealed semiconductor device, circuit member used for the device, and method of manufacturing the circuit member
DAINIPPON PRINTING CO LTD15 citations93
US7112287B2Sep 26, 2006
Thin film supporting substrate for used in filter for hydrogen production filter and method for manufacturing filter for hydrogen production
DAINIPPON PRINTING CO LTD20 citations92
US6774470B2Aug 10, 2004
Non-contact data carrier and method of fabricating the same
DAINIPPON PRINTING CO LTD34 citations92
US6465734B2Oct 15, 2002
Resin sealed semiconductor device, circuit member for use therein and method of manufacturing circuit member
DAINIPPON PRINTING CO LTD15 citations91
US7679925B2Mar 16, 2010
Method for fabricating wiring board provided with passive element, and wiring board provided with passive element
DAINIPPON PRINTING CO LTD10 citations84
US7857874B2Dec 28, 2010
Micro-reactor and method of manufacturing the same
DAINIPPON PRINTING CO LTD8 citations83
TDK CORP
5 patentsUS4731923AMar 22, 1988
Apparatus and method for mounting circuit element on printed circuit board
TDK CORP61 citations93
US4881319ANov 21, 1989
Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor
TDK CORP48 citations92
US5716481AFeb 10, 1998
Manufacturing method and manufacturing apparatus for ceramic electronic components
TDK CORP30 citations90
US5089314AFeb 18, 1992
Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
TDK CORP41 citations90
US4787143ANov 29, 1988
Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
TDK CORP48 citations88
GLOBERIDE INC
3 patentsWADA SATOSHI
2 patentsSEGA ENTERPRISES KK
2 patents(unassigned)
1 patentSEGA CORP
1 patentELCO CO LTD
1 patentDAIWA SEIKO INC
1 patentCHIYODA CHEM ENG CONSTRUCT CO
1 patentDAIKIN IND LTD
1 patentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD
1 patentD T CIRCUIT TECHNOLOGY CO LTD
1 patentFUJIMAGARI HIDEKI
1 patentAGENCY IND SCIENCE TECHN
1 patentShowing the top 50 of 130 patents by PatentIndex Score.