Inventor
HALEY KEVIN J
US9 patents
Patents
9 patentsUS7132313B2Nov 7, 2006
Diamond heat spreading and cooling technique for integrated circuits
INTEL CORP66 citations97
US6667548B2Dec 23, 2003
Diamond heat spreading and cooling technique for integrated circuits
INTEL CORP99 citations97
US5359768ANov 1, 1994
Method for mounting very small integrated circuit package on PCB
INTEL CORP79 citations95
US6313987B1Nov 6, 2001
Thermal connector for joining mobile electronic devices to docking stations
INTEL CORP42 citations92
US6043560AMar 28, 2000
Thermal interface thickness control for a microprocessor
INTEL CORP11 citations72
US5290735AMar 1, 1994
Thin, high leadcount package
INTEL CORP9 citations72
US6404047B1Jun 11, 2002
Socketable BGA package
INTEL CORP9 citations69
US6168976B1Jan 2, 2001
Socketable BGA package
INTEL CORP7 citations69
US5359225AOct 25, 1994
Thin, high leadcount package
INTEL CORP3 citations61