Inventor

BABCOCK JAMES WITTMAN

US29 patents

⚠️ This page may combine multiple inventors who share the name “BABCOCK JAMES WITTMAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BABCOCK JAMES WITTMAN

UNISYS CORP

Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink

Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested

Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature

Chip tester having a heat-exchanger with an extendable period of operation

Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint

Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profile

Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules

Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile

Method of extending the operational period of a heat-exchanger in a chip tester

Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module

Abrupt power change method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint

System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chips

System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater

Residue-free method of assembling and disassembling a pressed joint with low thermal resistance

Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed together

Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its corners

Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent

Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent

DELTA DESIGN INC

Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end

Dual feedback control system for maintaining the temperature of an IC-chip near a set-point

Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure

Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits

System and method for accelerating a device

Alignment mechanism

Alignment mechanism

Method of maintaining an IC-module near a set-point

TUSTANIWSKYJ JERRY IHOR

Alignment mechanism

System and method for accelerating a device

Temperature measurement using a diode with saturation current cancellation