Inventor

CHAN MICHAEL Y

US11 patents

⚠️ This page may combine multiple inventors who share the name “CHAN MICHAEL Y”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COMPAQ COMPUTER CORP

2 patents

US5764489AJun 9, 1998

Apparatus for controlling the impedance of high speed signals on a printed circuit board

COMPAQ COMPUTER CORP101 citations97

US5986893ANov 16, 1999

Apparatus for controlling the impedance of high speed signals on a printed circuit board

COMPAQ COMPUTER CORP53 citations96

INTEL CORP

2 patents

US7129172B2Oct 31, 2006

Bonded wafer processing method

INTEL CORP45 citations92

US7973407B2Jul 5, 2011

Three-dimensional stacked substrate arrangements

INTEL CORP12 citations83

RAMANATHAN SHRIRAM

2 patents

US8421225B2Apr 16, 2013

Three-dimensional stacked substrate arrangements

RAMANATHAN SHRIRAM14 citations91

US8203208B2Jun 19, 2012

Three-dimensional stacked substrate arrangements

RAMANATHAN SHRIRAM4 citations61

SCOTT PAPER CO

1 patent

US5118554AJun 2, 1992

Interleaved towel fold configuration

SCOTT PAPER CO102 citations94

KIMBERLY CLARK CO

1 patent

US6623833B2Sep 23, 2003

Towel fold configuration

KIMBERLY CLARK CO29 citations92

HEWLETT PACKARD DEVELOPMENT CO

1 patent

US7099966B2Aug 29, 2006

Point-to-point electrical loading for a multi-drop bus

HEWLETT PACKARD DEVELOPMENT CO6 citations62

CHAN MICHAEL Y

1 patent

US8481394B2Jul 9, 2013

Memory cell that includes a carbon-based memory element and methods of forming the same

CHAN MICHAEL Y0 citations44

APPLE INC

1 patent

US11404601B2Aug 2, 2022

Conductive micro LED architecture for on-wafer testing

APPLE INC0 citations40