Inventor
TWU JIH-CHURNG
TW42 patents
⚠️ This page may combine multiple inventors who share the name “TWU JIH-CHURNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
30 patentsUS6197701B1Mar 6, 2001
Lightly nitridation surface for preparing thin-gate oxides
TAIWAN SEMICONDUCTOR MFG90 citations98
US6753249B1Jun 22, 2004
Multilayer interface in copper CMP for low K dielectric
TAIWAN SEMICONDUCTOR MFG64 citations96
US6391780B1May 21, 2002
Method to prevent copper CMP dishing
TAIWAN SEMICONDUCTOR MFG78 citations96
US6380056B1Apr 30, 2002
Lightly nitridation surface for preparing thin-gate oxides
TAIWAN SEMICONDUCTOR MFG75 citations96
US6228760B1May 8, 2001
Use of PE-SiON or PE-OXIDE for contact or via photo and for defect reduction with oxide and W chemical-mechanical polish
TAIWAN SEMICONDUCTOR MFG46 citations96
US6429118B1Aug 6, 2002
Elimination of electrochemical deposition copper line damage for damascene processing
TAIWAN SEMICONDUCTOR MFG40 citations93
US6162716ADec 19, 2000
Amorphous silicon gate with mismatched grain-boundary microstructure
TAIWAN SEMICONDUCTOR MFG44 citations93
US6153526ANov 28, 2000
Method to remove residue in wolfram CMP
TAIWAN SEMICONDUCTOR MFG25 citations93
US6080656AJun 27, 2000
Method for forming a self-aligned copper structure with improved planarity
TAIWAN SEMICONDUCTOR MFG46 citations93
US6620725B1Sep 16, 2003
Reduction of Cu line damage by two-step CMP
TAIWAN SEMICONDUCTOR MFG32 citations92
US6227947B1May 8, 2001
Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer
TAIWAN SEMICONDUCTOR MFG35 citations92
US6503333B2Jan 7, 2003
Method for cleaning semiconductor wafers with ozone-containing solvent
TAIWAN SEMICONDUCTOR MFG24 citations91
US6376377B1Apr 23, 2002
Post chemical mechanical polish (CMP) planarizing substrate cleaning method employing enhanced substrate hydrophilicity
TAIWAN SEMICONDUCTOR MFG14 citations84
US6358119B1Mar 19, 2002
Way to remove CU line damage after CU CMP
TAIWAN SEMICONDUCTOR MFG15 citations84
US6405452B1Jun 18, 2002
Method and apparatus for drying wafers after wet bench
TAIWAN SEMICONDUCTOR MFG14 citations81
US6878578B1Apr 12, 2005
Method for forming a high quality chemical oxide on a freshly cleaned silicon surface as a native oxide replacement
TAIWAN SEMICONDUCTOR MFG15 citations80
US6706577B1Mar 16, 2004
Formation of dual gate oxide by two-step wet oxidation
TAIWAN SEMICONDUCTOR MFG8 citations74
US6589872B1Jul 8, 2003
Use of low-high slurry flow to eliminate copper line damages
TAIWAN SEMICONDUCTOR MFG8 citations74
US6417106B1Jul 9, 2002
Underlayer liner for copper damascene in low k dielectric
TAIWAN SEMICONDUCTOR MFG11 citations74
US6211098B1Apr 3, 2001
Wet oxidation method for forming silicon oxide dielectric layer
TAIWAN SEMICONDUCTOR MFG10 citations74
US6837774B2Jan 4, 2005
Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
TAIWAN SEMICONDUCTOR MFG9 citations73
US6924215B2Aug 2, 2005
Method of monitoring high tilt angle of medium current implant
TAIWAN SEMICONDUCTOR MFG8 citations68
US6500753B2Dec 31, 2002
Method to reduce the damages of copper lines
TAIWAN SEMICONDUCTOR MFG5 citations63
US6642128B1Nov 4, 2003
Method for high temperature oxidations to prevent oxide edge peeling
TAIWAN SEMICONDUCTOR MFG4 citations62
US6777251B2Aug 17, 2004
Metrology for monitoring a rapid thermal annealing process
TAIWAN SEMICONDUCTOR MFG2 citations60
US6589356B1Jul 8, 2003
Method for cleaning a silicon-based substrate without NH4OH vapor damage
TAIWAN SEMICONDUCTOR MFG5 citations60
US6425191B1Jul 30, 2002
Apparatus and method for reducing solvent residue in a solvent-type dryer for semiconductor wafers
TAIWAN SEMICONDUCTOR MFG6 citations60
US6239023B1May 29, 2001
Method to reduce the damages of copper lines
TAIWAN SEMICONDUCTOR MFG1 citations52
US6500274B2Dec 31, 2002
Apparatus and method for wet cleaning wafers without ammonia vapor damage
TAIWAN SEMICONDUCTOR MFG0 citations50
US6647998B2Nov 18, 2003
Electrostatic charge-free solvent-type dryer for semiconductor wafers
TAIWAN SEMICONDUCTOR MFG0 citations46
TAIWAN SEMICONDUCTOR MFG CO LTD
9 patentsUS11239099B2Feb 1, 2022
Tool monitoring device and method of monitoring tool
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US12394684B2Aug 19, 2025
Die stacking structure, semiconductor package and formation method of the die stacking structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12550417B2Feb 10, 2026
Integrated circuit packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11804392B2Oct 31, 2023
Method of monitoring tool
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations58
US10930527B2Feb 23, 2021
Method for controlling temperature of furnace in semiconductor fabrication process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US11569062B2Jan 31, 2023
Gas delivery system for ion implanter
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US12593632B2Mar 31, 2026
Method of implanting semiconductor donor substrate and method of manufacturing semiconductor-on-insulator structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US11056365B2Jul 6, 2021
Fault detection method in semiconductor fabrication facility
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
US10741426B2Aug 11, 2020
Method for controlling temperature of furnace in semiconductor fabrication process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations45