Inventor
NEO SIEW S
US12 patents
Patents
12 patentsUS6962524B2Nov 8, 2005
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC80 citations97
US7422516B2Sep 9, 2008
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC42 citations96
US6991528B2Jan 31, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC45 citations96
US7278911B2Oct 9, 2007
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC33 citations92
US7229535B2Jun 12, 2007
Hydrogen bubble reduction on the cathode using double-cell designs
APPLIED MATERIALS INC25 citations92
US7160432B2Jan 9, 2007
Method and composition for polishing a substrate
APPLIED MATERIALS INC21 citations92
US7128825B2Oct 31, 2006
Method and composition for polishing a substrate
APPLIED MATERIALS INC20 citations92
US7790015B2Sep 7, 2010
Endpoint for electroprocessing
APPLIED MATERIALS INC8 citations84
US7232514B2Jun 19, 2007
Method and composition for polishing a substrate
APPLIED MATERIALS INC15 citations84
US7207878B2Apr 24, 2007
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC11 citations84
US7628905B2Dec 8, 2009
Algorithm for real-time process control of electro-polishing
APPLIED MATERIALS INC2 citations63
US7112270B2Sep 26, 2006
Algorithm for real-time process control of electro-polishing
APPLIED MATERIALS INC3 citations63