Inventor
ENOKIDO SATOSHI
JP13 patents
Patents
13 patentsUS6467673B2Oct 22, 2002
Bonding apparatus and bonding method
SHINKAWA KK27 citations92
US6464126B2Oct 15, 2002
Bonding apparatus and bonding method
SHINKAWA KK32 citations92
US7224829B2May 29, 2007
Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program
SHINKAWA KK18 citations91
US6762848B2Jul 13, 2004
Offset measurement method, tool position detection method and bonding apparatus
SHINKAWA KK13 citations83
US7324684B2Jan 29, 2008
Bonding apparatus
SHINKAWA KK7 citations73
US7209583B2Apr 24, 2007
Bonding method, bonding apparatus and bonding program
SHINKAWA KK6 citations73
US10262968B2Apr 16, 2019
Wire bonding apparatus and wire bonding method
SHINKAWA KK2 citations72
US5772040AJun 30, 1998
Workpiece conveying apparatus used with workpiece inspection device
SHINKAWA KK12 citations71
US6814121B2Nov 9, 2004
Bonding apparatus
SHINKAWA KK4 citations62
US12217996B2Feb 4, 2025
Conveying device
SHINKAWA KK0 citations52
US7330582B2Feb 12, 2008
Bonding program
SHINKAWA KK0 citations51
US7324683B2Jan 29, 2008
Bonding pattern discrimination device
SHINKAWA KK0 citations51
US7321681B2Jan 22, 2008
Bonding pattern discrimination program
SHINKAWA KK0 citations51