P

Inventor

MORIMOTO NOBUYUKI

JP32 patents
⚠️ This page may combine multiple inventors who share the name “MORIMOTO NOBUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUMCO CORP

20 patents
US7446016B2Nov 4, 2008

Method for producing bonded wafer

SUMCO CORP8 citations74
US7851337B2Dec 14, 2010

Method for producing semiconductor substrate

SUMCO CORP5 citations73
US7510948B2Mar 31, 2009

Method for producing SOI wafer

SUMCO CORP7 citations73
US8048767B2Nov 1, 2011

Bonded wafer and method for producing bonded wafer

SUMCO CORP2 citations63
US7855132B2Dec 21, 2010

Method of manufacturing bonded wafer

SUMCO CORP2 citations63
US7713838B2May 11, 2010

SOI wafer and its manufacturing method

SUMCO CORP4 citations63
US7544583B2Jun 9, 2009

SOI wafer and its manufacturing method

SUMCO CORP3 citations63
US7494899B2Feb 24, 2009

Method for manufacturing semiconductor substrate

SUMCO CORP4 citations63
US7951692B2May 31, 2011

Method of producing semiconductor substrate having an SOI structure

SUMCO CORP3 citations62
US7858494B2Dec 28, 2010

Laminated substrate manufacturing method and laminated substrate manufactured by the method

SUMCO CORP6 citations62
US7795117B2Sep 14, 2010

Method of producing semiconductor substrate having an SOI structure

SUMCO CORP2 citations62
US7563697B2Jul 21, 2009

Method for producing SOI wafer

SUMCO CORP6 citations62
US7507641B2Mar 24, 2009

Method of producing bonded wafer

SUMCO CORP4 citations62
US7358147B2Apr 15, 2008

Process for producing SOI wafer

SUMCO CORP4 citations62
US7902043B2Mar 8, 2011

Method of producing bonded wafer

SUMCO CORP0 citations52
US8003494B2Aug 23, 2011

Method for producing a bonded wafer

SUMCO CORP1 citations51
US7534728B2May 19, 2009

Process for cleaning silicon substrate

SUMCO CORP1 citations51
US7799655B2Sep 21, 2010

Method for evaluation of bonded wafer

SUMCO CORP0 citations48
US8048769B2Nov 1, 2011

Method for producing bonded wafer

SUMCO CORP0 citations41
US7927957B2Apr 19, 2011

Method for producing bonded silicon wafer

SUMCO CORP0 citations41

RES ASS PETROLEUM ALTERNAT DEV

3 patents

PANASONIC IP MAN CO LTD

3 patents

PANASONIC CORP

1 patent

MATSUSHITA SEIKO KK

1 patent

MURAKAMI SATOSHI

1 patent

AKIYOSHI KAZUNARI

1 patent

MORIMOTO NOBUYUKI

1 patent

KATSUNUMA TOSHINARI

1 patent