P

Inventor

OHTO KOICHI

JP31 patents
⚠️ This page may combine multiple inventors who share the name “OHTO KOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC ELECTRONICS CORP

20 patents
US7531891B2May 12, 2009

Semiconductor device

NEC ELECTRONICS CORP22 citations92
US7391115B2Jun 24, 2008

Semiconductor device and manufacturing method thereof

NEC ELECTRONICS CORP23 citations92
US7132732B2Nov 7, 2006

Semiconductor device having two distinct sioch layers

NEC ELECTRONICS CORP16 citations92
US7763979B2Jul 27, 2010

Organic insulating film, manufacturing method thereof, semiconductor device using such organic insulating film and manufacturing method thereof

NEC ELECTRONICS CORP12 citations84
US7615498B2Nov 10, 2009

Method of manufacturing a semiconductor device

NEC ELECTRONICS CORP10 citations84
US7180191B2Feb 20, 2007

Semiconductor device and method of manufacturing a semiconductor device

NEC ELECTRONICS CORP14 citations84
US6879042B2Apr 12, 2005

Semiconductor device and method and apparatus for manufacturing the same

NEC ELECTRONICS CORP13 citations84
US7563705B2Jul 21, 2009

Manufacturing method of semiconductor device

NEC ELECTRONICS CORP10 citations83
US7268087B2Sep 11, 2007

Manufacturing method of semiconductor device

NEC ELECTRONICS CORP10 citations83
US7473630B2Jan 6, 2009

Semiconductor device and method for manufacturing same

NEC ELECTRONICS CORP7 citations74
US7119441B2Oct 10, 2006

Semiconductor interconnect structure

NEC ELECTRONICS CORP7 citations74
US7737555B2Jun 15, 2010

Semiconductor method having silicon-diffused metal wiring layer

NEC ELECTRONICS CORP6 citations73
US7687917B2Mar 30, 2010

Single damascene structure semiconductor device having silicon-diffused metal wiring layer

NEC ELECTRONICS CORP7 citations73
US7745937B2Jun 29, 2010

Semiconductor device and method of manufacturing the same

NEC ELECTRONICS CORP4 citations63
US7649258B2Jan 19, 2010

Semiconductor device

NEC ELECTRONICS CORP6 citations63
US7564132B2Jul 21, 2009

Semiconductor chip

NEC ELECTRONICS CORP2 citations63
US7557447B2Jul 7, 2009

Semiconductor device and method for manufacturing same

NEC ELECTRONICS CORP4 citations63
US7135776B2Nov 14, 2006

Semiconductor device and method for manufacturing same

NEC ELECTRONICS CORP2 citations63
US7833901B2Nov 16, 2010

Method for manufacturing a semiconductor device having a multi-layered insulating structure of SiOCH layers and an SiO2 layer

NEC ELECTRONICS CORP5 citations62
US7074698B2Jul 11, 2006

Method of fabricating semiconductor device using plasma-enhanced CVD

NEC ELECTRONICS CORP5 citations62

NEC CORP

3 patents

RENESAS ELECTRONICS CORP

3 patents

OHTO KOICHI

2 patents

USAMI TATSUYA

1 patent

OSHIDA DAISUKE

1 patent

YAMAMOTO HIRONORI

1 patent