Inventor
FUKE KAZUHIRO
JP30 patents
⚠️ This page may combine multiple inventors who share the name “FUKE KAZUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
15 patentsUS8975101B2Mar 10, 2015
Element connecting board, producing method thereof, and light emitting diode device
NITTO DENKO CORP2 citations62
US9082940B2Jul 14, 2015
Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
NITTO DENKO CORP3 citations61
US8017670B2Sep 13, 2011
Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
NITTO DENKO CORP3 citations60
US11654655B2May 23, 2023
Reinforcement sheet, reinforcement member, reinforcement kit, producing method of reinforcement sheet, and producing method of reinforcement member
NITTO DENKO CORP0 citations57
US11654656B2May 23, 2023
Reinforcement sheet, reinforcement member, reinforcement kit, producing method of reinforcement sheet, and producing method of reinforcement member
NITTO DENKO CORP0 citations57
US12553989B2Feb 17, 2026
Radio wave scattering body, and member for attenuating radio waves comprising radio wave scattering body
NITTO DENKO CORP0 citations55
US11476586B2Oct 18, 2022
Radio wave absorbing member, radio wave absorbing structure, and inspection apparatus
NITTO DENKO CORP0 citations54
US9287473B2Mar 15, 2016
Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
NITTO DENKO CORP0 citations51
US9029894B2May 12, 2015
Lead frame for optical semiconductor device and optical semiconductor device using the same
NITTO DENKO CORP0 citations51
US8378442B2Feb 19, 2013
Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device
NITTO DENKO CORP1 citations51
US9450158B2Sep 20, 2016
Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition
NITTO DENKO CORP0 citations48
US7986050B2Jul 26, 2011
Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
NITTO DENKO CORP1 citations48
US11964439B2Apr 23, 2024
Reinforcement structure and producing method of reinforcement structure
NITTO DENKO CORP0 citations47
US12185514B2Dec 31, 2024
Electromagnetic shield
NITTO DENKO CORP0 citations44
US8907502B2Dec 9, 2014
Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
NITTO DENKO CORP0 citations40
SAKATA INX CORP
10 patentsUS10767068B2Sep 8, 2020
Photocurable inkjet printing ink composition
SAKATA INX CORP7 citations83
US11912881B2Feb 27, 2024
Ink composition for photo-curable ink jet printing
SAKATA INX CORP2 citations72
US10550275B2Feb 4, 2020
UV-LED curable clear ink composition for ink jet printing
SAKATA INX CORP4 citations72
US11230647B2Jan 25, 2022
Photocurable clear ink composition for inkjet printing
SAKATA INX CORP4 citations71
US12503618B2Dec 23, 2025
Photocurable inkjet printing ink composition
SAKATA INX CORP0 citations62
US11414558B2Aug 16, 2022
Photocurable inkjet printing ink composition
SAKATA INX CORP1 citations62
US10584253B2Mar 10, 2020
Light-curable inkjet printing ink composition
SAKATA INX CORP0 citations51
US12110399B2Oct 8, 2024
Photocurable inkjet printing ink composition
SAKATA INX CORP0 citations49
US10543695B2Jan 28, 2020
Photocurable white ink composition for inkjet printing
SAKATA INX CORP0 citations41
US10035919B2Jul 31, 2018
Photocurable ink composition for inkjet printing
SAKATA INX CORP0 citations41