P

Inventor

NGUYEN LONG

US60 patents
⚠️ This page may combine multiple inventors who share the name “NGUYEN LONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED TECH MATERIALS

17 patents
US6896826B2May 24, 2005

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

ADVANCED TECH MATERIALS74 citations97
US6755989B2Jun 29, 2004

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

ADVANCED TECH MATERIALS43 citations96
US6409781B1Jun 25, 2002

Polishing slurries for copper and associated materials

ADVANCED TECH MATERIALS71 citations96
US6344432B1Feb 5, 2002

Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures

ADVANCED TECH MATERIALS51 citations96
US6280651B1Aug 28, 2001

Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent

ADVANCED TECH MATERIALS69 citations96
US6306807B1Oct 23, 2001

Boric acid containing compositions for stripping residues from semiconductor substrates

ADVANCED TECH MATERIALS38 citations95
US6967169B2Nov 22, 2005

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

ADVANCED TECH MATERIALS16 citations92
US6527819B2Mar 4, 2003

Polishing slurries for copper and associated materials

ADVANCED TECH MATERIALS24 citations92
US6383410B1May 7, 2002

Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent

ADVANCED TECH MATERIALS24 citations92
US6566315B2May 20, 2003

Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures

ADVANCED TECH MATERIALS50 citations89
US7605113B2Oct 20, 2009

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

ADVANCED TECH MATERIALS11 citations84
US6936542B2Aug 30, 2005

Polishing slurries for copper and associated materials

ADVANCED TECH MATERIALS9 citations73
US6492310B2Dec 10, 2002

Boric acid containing compositions for stripping residues from semiconductor substrates

ADVANCED TECH MATERIALS6 citations73
US7662762B2Feb 16, 2010

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates

ADVANCED TECH MATERIALS4 citations62
US6599870B2Jul 29, 2003

Boric acid containing compositions for stripping residues from semiconductor substrates

ADVANCED TECH MATERIALS2 citations62
US7427567B2Sep 23, 2008

Polishing slurries for copper and associated materials

ADVANCED TECH MATERIALS1 citations58
US9109188B2Aug 18, 2015

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

ADVANCED TECH MATERIALS0 citations52

CASTLEWOOD SYS INC

7 patents

ENANTA PHARM INC

5 patents

VERIZON CORPORATE SERV GROUP

3 patents

APPLIED MATERIALS INC

2 patents

OAK TECHNOLOGY INC

2 patents

GENUITY INC

2 patents

NANOCEROX INC

2 patents

AMAZON TECH INC

2 patents

PICKHOLZ ARIEL

2 patents

BBN CORP

1 patent

SILICON LAB INC

1 patent

ADVANCED TECHNOLOGIES MATERIAL

1 patent

THOMAS WEST INC

1 patent

NGUYEN LONG

1 patent

FINISAR CORP

1 patent

Showing the top 50 of 60 patents by PatentIndex Score.