Inventor

HLAD MARK S

US14 patents

⚠️ This page may combine multiple inventors who share the name “HLAD MARK S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

7 patents

US9583390B2Feb 28, 2017

Organic thin film passivation of metal interconnections

INTEL CORP3 citations71

US9824991B2Nov 21, 2017

Organic thin film passivation of metal interconnections

INTEL CORP1 citations61

US7776734B2Aug 17, 2010

Barrier layer for fine-pitch mask-based substrate bumping

INTEL CORP3 citations61

US9355952B2May 31, 2016

Device packaging with substrates having embedded lines and metal defined pads

INTEL CORP0 citations52

US9093313B2Jul 28, 2015

Device packaging with substrates having embedded lines and metal defined pads

INTEL CORP0 citations52

US8809124B2Aug 19, 2014

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

INTEL CORP0 citations51

US7919408B2Apr 5, 2011

Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates

INTEL CORP0 citations51

ALEKSOV ALEKSANDAR

1 patent

US9257276B2Feb 9, 2016

Organic thin film passivation of metal interconnections

ALEKSOV ALEKSANDAR5 citations82

MANUSHAROW MATHEW J

1 patent

US8508037B2Aug 13, 2013

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

MANUSHAROW MATHEW J9 citations82

CHASE HAROLD R

1 patent

US9198293B2Nov 24, 2015

Non-cylindrical conducting shapes in multilayer laminated substrate cores

CHASE HAROLD R8 citations75

ZHANG QINGLEI

1 patent

US9299602B2Mar 29, 2016

Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package

ZHANG QINGLEI2 citations55

NALLA RAVI K

1 patent

US8183692B2May 22, 2012

Barrier layer for fine-pitch mask-based substrate bumping

NALLA RAVI K0 citations50

HLAD MARK S

1 patent

US8835217B2Sep 16, 2014

Device packaging with substrates having embedded lines and metal defined pads

HLAD MARK S0 citations45

SCHUCKMAN AMANDA E

1 patent

US8877632B1Nov 4, 2014

Providing a void-free filled interconnect structure in a layer of package substrate

SCHUCKMAN AMANDA E0 citations44