Inventor
YANG CHUNG-YING
TW16 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHUNG-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHEN HSIEN-WEI
5 patentsUS8395239B2Mar 12, 2013
Grounded seal ring structure in semiconductor devices
CHEN HSIEN-WEI16 citations84
US8253217B2Aug 28, 2012
Seal ring structure in semiconductor devices
CHEN HSIEN-WEI16 citations84
US8237160B2Aug 7, 2012
Probe pad on a corner stress relief region in a semiconductor chip
CHEN HSIEN-WEI8 citations84
US9478505B2Oct 25, 2016
Guard ring design structure for semiconductor devices
CHEN HSIEN-WEI0 citations52
US9236322B2Jan 12, 2016
Methods and apparatus for heat spreader on silicon
CHEN HSIEN-WEI0 citations52
YANG CHUNG-YING
4 patentsUS8669651B2Mar 11, 2014
Package-on-package structures with reduced bump bridging
YANG CHUNG-YING9 citations83
US8624359B2Jan 7, 2014
Wafer level chip scale package and method of manufacturing the same
YANG CHUNG-YING7 citations83
US8217394B2Jul 10, 2012
Probe pad on a corner stress relief region in a semiconductor chip
YANG CHUNG-YING16 citations83
US8796686B2Aug 5, 2014
Integrated circuits with leakage current test structure
YANG CHUNG-YING3 citations61
TAIWAN SEMICONDUCTOR MFG
3 patentsUS8957503B2Feb 17, 2015
Chip package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG6 citations84
US9337117B2May 10, 2016
Chip package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG0 citations52
US9064939B2Jun 23, 2015
Methods of making integrated circuits
TAIWAN SEMICONDUCTOR MFG1 citations52