Inventor

TAN SAMANTHA

US36 patents

⚠️ This page may combine multiple inventors who share the name “TAN SAMANTHA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAN SAMANTHA

LAM RES CORP

Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors

Dry plasma etch method to pattern MRAM stack

Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)

Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)

Integrated etch/clean for dielectric etch applications

Eliminating yield impact of stochastics in lithography

Eliminating yield impact of stochastics in lithography

Tin oxide films in semiconductor device manufacturing

Dry plasma etch method to pattern MRAM stack

Etching substrates using ale and selective deposition

Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)

Atomic layer etching of tungsten and other metals

Atomic layer etching of tungsten for enhanced tungsten deposition fill

Atomic layer etching for enhanced bottom-up feature fill

Atomic layer etching of GaN and other III-V materials

Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors

High energy atomic layer etching

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Dry plasma etch method to pattern MRAM stack

Etching substrates using ALE and selective deposition

ALE smoothness: in and outside semiconductor industry

Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors

Directional deposition on patterned structures

Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces

Ale smoothness: in and outside semiconductor industry

Selective self-aligned patterning of silicon germanium, germanium and type III/V materials using a sulfur-containing mask

Selective processing with etch residue-based inhibitors

Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials

Metal doped carbon based hard mask removal in semiconductor fabrication

Selective self-aligned patterning of silicon germanium, germanium and type III/V materials using a sulfur-containing mask

Methods for wet metal seed deposition for bottom up gapfill of features

CHEMTRACE CORP

Method for cleaning semiconductor fabrication equipment parts

Cleaning of semiconductor process equipment chamber parts using organic solvents

CHEMTRACE PREC CLEANING INC

Ultrasonic assisted etch using corrosive liquids

APPLIED MATERIALS INC

Ultrasonic assisted etch using corrosive liquids

WANG JIANSHENG

Methods and apparatus for ex situ seasoning of electronic device manufacturing process components