Inventor
PARK JIN SEON
KR24 patents
⚠️ This page may combine multiple inventors who share the name “PARK JIN SEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
7 patentsUS7886414B2Feb 15, 2011
Method of manufacturing capacitor-embedded PCB
SAMSUNG ELECTRO MECH7 citations83
US11095037B2Aug 17, 2021
Antenna module
SAMSUNG ELECTRO MECH2 citations73
US11539138B2Dec 27, 2022
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH1 citations62
US11183765B2Nov 23, 2021
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH0 citations62
US11133592B2Sep 28, 2021
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH1 citations62
US10270948B2Apr 23, 2019
Substrate for camera module and camera module having the same
SAMSUNG ELECTRO MECH1 citations62
US11101840B1Aug 24, 2021
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH0 citations51
SAMSUNG ELECTRONICS CO LTD
5 patentsUS10763225B2Sep 1, 2020
Antenna module
SAMSUNG ELECTRONICS CO LTD6 citations84
US11217543B2Jan 4, 2022
Antenna module
SAMSUNG ELECTRONICS CO LTD2 citations73
US11909099B2Feb 20, 2024
Antenna module
SAMSUNG ELECTRONICS CO LTD0 citations62
US11177551B2Nov 16, 2021
Antenna module
SAMSUNG ELECTRONICS CO LTD0 citations62
US10790595B2Sep 29, 2020
Antenna module and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD1 citations62
IUCF HYU
5 patentsUS11732354B2Aug 22, 2023
Method and apparatus for forming layer, metal oxide transistor and fabrication method thereof
IUCF HYU0 citations61
US11015243B2May 25, 2021
Method and apparatus for forming layer, metal oxide transistor and fabrication method thereof
IUCF HYU0 citations61
US10991831B2Apr 27, 2021
Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element
IUCF HYU0 citations61
US10985247B2Apr 20, 2021
Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element
IUCF HYU0 citations61
US10978561B2Apr 13, 2021
Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element
IUCF HYU0 citations61
PARK JIN SEON
3 patentsUS8305766B2Nov 6, 2012
Electronic component-embedded printed circuit board and method of manufacturing the same
PARK JIN SEON6 citations82
US8552305B2Oct 8, 2013
Electronic component-embedded printed circuit board
PARK JIN SEON3 citations61
US8826527B2Sep 9, 2014
Electronic component-embedded printed circuit board and method of manufacturing the same
PARK JIN SEON3 citations60