Inventor
WANG YU-PIAO
TW26 patents
⚠️ This page may combine multiple inventors who share the name “WANG YU-PIAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IV TECH CO LTD
9 patentsUSRE46648EDec 26, 2017
Polishing pad, polishing method and method of forming polishing pad
IV TECH CO LTD3 citations72
US11872671B2Jan 16, 2024
Polishing pad and polishing method
IV TECH CO LTD0 citations62
US11524389B2Dec 13, 2022
Polishing pad and polishing method
IV TECH CO LTD0 citations62
US11498181B2Nov 15, 2022
Polishing pad and manufacturing method of polishing pad and polishing method
IV TECH CO LTD0 citations62
US11858089B2Jan 2, 2024
Polishing layer and polishing method
IV TECH CO LTD0 citations54
US11541505B2Jan 3, 2023
Polishing pad, manufacturing method of polishing pad and polishing method
IV TECH CO LTD0 citations53
US10478940B2Nov 19, 2019
Manufacturing method of polishing layer, and polishing method
IV TECH CO LTD0 citations44
US10518386B2Dec 31, 2019
Polishing pad and polishing method
IV TECH CO LTD0 citations43
US11850701B2Dec 26, 2023
Polishing pad, manufacturing method of polishing pad and polishing method
IV TECH CO LTD0 citations41
WANG YU-PIAO
7 patentsUS8398461B2Mar 19, 2013
Polishing method, polishing pad and polishing system
WANG YU-PIAO23 citations92
US8870626B2Oct 28, 2014
Polishing pad, polishing method and polishing system
WANG YU-PIAO17 citations83
US8118645B2Feb 21, 2012
Polishing method, polishing pad, and polishing system
WANG YU-PIAO4 citations62
US8721394B2May 13, 2014
Polishing pad and polishing method
WANG YU-PIAO0 citations51
US8303378B2Nov 6, 2012
Polishing pad, polishing method and method of forming polishing pad
WANG YU-PIAO0 citations51
US8303382B2Nov 6, 2012
Polishing pad and method of fabrication
WANG YU-PIAO0 citations49
US9393665B2Jul 19, 2016
Polishing method and polishing system
WANG YU-PIAO1 citations42
UNITED MICROELECTRONICS CORP
4 patentsUS6465348B1Oct 15, 2002
Method of fabricating an MOCVD titanium nitride layer utilizing a pulsed plasma treatment to remove impurities
UNITED MICROELECTRONICS CORP25 citations92
US6803310B2Oct 12, 2004
Method for forming a plug metal layer
UNITED MICROELECTRONICS CORP9 citations72
US6787461B2Sep 7, 2004
Method for forming a plug metal layer
UNITED MICROELECTRONICS CORP9 citations72
US6686278B2Feb 3, 2004
Method for forming a plug metal layer
UNITED MICROELECTRONICS CORP11 citations72
PROMOS TECHNOLOGIES INC
3 patentsUS6960808B2Nov 1, 2005
Semiconductor device having a lower parasitic capacitance
PROMOS TECHNOLOGIES INC6 citations73
US6680258B1Jan 20, 2004
Method of forming an opening through an insulating layer of a semiconductor device
PROMOS TECHNOLOGIES INC8 citations71
US7148113B2Dec 12, 2006
Semiconductor device and fabricating method thereof
PROMOS TECHNOLOGIES INC3 citations62