Inventor
DIXIT GIRISH
IN37 patents
⚠️ This page may combine multiple inventors who share the name “DIXIT GIRISH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS6451177B1Sep 17, 2002
Vault shaped target and magnetron operable in two sputtering modes
APPLIED MATERIALS INC103 citations99
US6589352B1Jul 8, 2003
Self aligning non contact shadow ring process kit
APPLIED MATERIALS INC566 citations98
US6277249B1Aug 21, 2001
Integrated process for copper via filling using a magnetron and target producing highly energetic ions
APPLIED MATERIALS INC273 citations98
US6274008B1Aug 14, 2001
Integrated process for copper via filling
APPLIED MATERIALS INC231 citations98
US6991709B2Jan 31, 2006
Multi-step magnetron sputtering process
APPLIED MATERIALS INC46 citations96
US6787006B2Sep 7, 2004
Operating a magnetron sputter reactor in two modes
APPLIED MATERIALS INC53 citations96
US6485618B2Nov 26, 2002
Integrated copper fill process
APPLIED MATERIALS INC47 citations96
US6824612B2Nov 30, 2004
Electroless plating system
APPLIED MATERIALS INC67 citations95
US6913680B1Jul 5, 2005
Method of application of electrical biasing to enhance metal deposition
APPLIED MATERIALS INC30 citations92
US6905622B2Jun 14, 2005
Electroless deposition method
APPLIED MATERIALS INC32 citations92
US6899816B2May 31, 2005
Electroless deposition method
APPLIED MATERIALS INC24 citations92
US6610189B2Aug 26, 2003
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
APPLIED MATERIALS INC35 citations92
US6808611B2Oct 26, 2004
Methods in electroanalytical techniques to analyze organic components in plating baths
APPLIED MATERIALS INC42 citations89
US8342119B2Jan 1, 2013
Self aligning non contact shadow ring process kit
APPLIED MATERIALS INC11 citations83
US6746591B2Jun 8, 2004
ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature
APPLIED MATERIALS INC16 citations79
US6797620B2Sep 28, 2004
Method and apparatus for improved electroplating fill of an aperture
APPLIED MATERIALS INC12 citations73
US6773569B2Aug 10, 2004
Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives
APPLIED MATERIALS INC3 citations60
US7848839B2Dec 7, 2010
System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss
APPLIED MATERIALS INC1 citations51
SGS THOMSON MICROELECTRONICS
4 patentsUS5391520AFeb 21, 1995
Method for forming local interconnect for integrated circuits
SGS THOMSON MICROELECTRONICS22 citations93
US5319245AJun 7, 1994
Local interconnect for integrated circuits
SGS THOMSON MICROELECTRONICS16 citations82
US5285103AFeb 8, 1994
Structure and method for contacts in CMOS devices
SGS THOMSON MICROELECTRONICS11 citations74
US5164340ANov 17, 1992
Structure and method for contacts in cmos devices
SGS THOMSON MICROELECTRONICS7 citations74
NOVELLUS SYSTEMS INC
3 patentsUS9390909B2Jul 12, 2016
Soft landing nanolaminates for advanced patterning
NOVELLUS SYSTEMS INC500 citations99
US7727882B1Jun 1, 2010
Compositionally graded titanium nitride film for diffusion barrier applications
NOVELLUS SYSTEMS INC60 citations95
US8017523B1Sep 13, 2011
Deposition of doped copper seed layers having improved reliability
NOVELLUS SYSTEMS INC27 citations92
DIXIT GIRISH
3 patentsUS8314235B2Nov 20, 2012
Process for preparing varenicline, varenicline intermediates, pharmaceutically acceptable salts thereof
DIXIT GIRISH45 citations89
US8552194B2Oct 8, 2013
Process for preparing quinoline-3-carboxamide derivatives
DIXIT GIRISH2 citations58
US8101597B2Jan 24, 2012
Quetiapine salts and their polymorphs
DIXIT GIRISH5 citations55