Inventor

JANG HYUNG-SUN

KR21 patents

⚠️ This page may combine multiple inventors who share the name “JANG HYUNG-SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JANG HYUNG-SUN

SAMSUNG ELECTRONICS CO LTD

Camera module and electronic apparatus having the same

Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Wafer-level package including under bump metal layer

Wafer-level package including under bump metal layer

Wafer-level package including under bump metal layer

Semiconductor package and method of manufacturing the same

HYUNDAI MOTOR CO LTD

Apparatus and method for deciding a maneuver of a nearby vehicle

Vehicle and method of controlling engine start for the same

Apparatus and method for identifying short cut-in vehicle and vehicle using the same

Omnidirectional sensor fusion system and method and vehicle including the same

Apparatus and method for associating sensor data in vehicle

ODM information reliability determination system and method and vehicle using the same

LEE HYUEK-JAE

Image sensor having through via

Methods of packaging semiconductor devices including bridge patterns

KIM JUNG-HWAN

Semiconductor package and method of manufacturing the same

HONG JISUN

Method for wafer level package and semiconductor device fabricated using the same

KWON WOON-SEONG

Camera modules and methods of fabricating the same

MYUNG JONG-YUN

Method of forming semiconductor device

JANG HYUNG-SUN

Semiconductor package and method of manufacturing the same