Inventor
Hong min hao
TW25 patents
⚠️ This page may combine multiple inventors who share the name “Hong min hao”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS10357867B2Jul 23, 2019
Polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US9478581B2Oct 25, 2016
Grids in backside illumination image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US9536834B2Jan 3, 2017
Reverse damascene process
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations82
US10204807B2Feb 12, 2019
Apparatus and method for processing wafer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9718164B2Aug 1, 2017
Polishing system and polishing method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9607946B2Mar 28, 2017
Reverse damascene process
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US11961884B2Apr 16, 2024
Fill structures with air gaps
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68
US11358252B2Jun 14, 2022
Method of using a polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9214514B2Dec 15, 2015
Mechanisms for forming semiconductor device having stable dislocation profile
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12324199B2Jun 3, 2025
Fill structures with air gaps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US10861721B2Dec 8, 2020
Apparatus and method for processing wafer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9786707B2Oct 10, 2017
Image sensor isolation region and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9502280B2Nov 22, 2016
Two-step shallow trench isolation (STI) process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
JANGJIAN SHIU-KO
5 patentsUS9041140B2May 26, 2015
Grids in backside illumination image sensor chips and methods for forming the same
JANGJIAN SHIU-KO4 citations72
US8772899B2Jul 8, 2014
Method and apparatus for backside illumination sensor
JANGJIAN SHIU-KO3 citations62
US9673244B2Jun 6, 2017
Image sensor isolation region and method of forming the same
JANGJIAN SHIU-KO0 citations52
US9349902B2May 24, 2016
System and method for reducing irregularities on the surface of a backside illuminated photodiode
JANGJIAN SHIU-KO0 citations52
US8889461B2Nov 18, 2014
CIS image sensors with epitaxy layers and methods for forming the same
JANGJIAN SHIU-KO1 citations51
TAIWAN SEMICONDUCTOR MFG
3 patentsUS9257476B2Feb 9, 2016
Grids in backside illumination image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG11 citations83
US9368540B2Jun 14, 2016
CIS image sensors with epitaxy layers and methods for forming the same
TAIWAN SEMICONDUCTOR MFG1 citations52
US9006070B2Apr 14, 2015
Two-step shallow trench isolation (STI) process
TAIWAN SEMICONDUCTOR MFG0 citations51