Inventor

BADAKERE GURUPRASAD G

SG5 patents

⚠️ This page may combine multiple inventors who share the name “BADAKERE GURUPRASAD G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US7838395B2Nov 23, 2010

Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same

STATS CHIPPAC LTD15 citations91

US7842607B2Nov 30, 2010

Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via

STATS CHIPPAC LTD8 citations83

BADAKERE GURUPRASAD G

2 patents

US8097943B2Jan 17, 2012

Semiconductor device and method of forming wafer level ground plane and power ring

BADAKERE GURUPRASAD G11 citations80

US9390991B2Jul 12, 2016

Semiconductor device and method of forming wafer level ground plane and power ring

BADAKERE GURUPRASAD G0 citations48

STATS CHIPPAC PTE LTD

1 patent

US10651139B2May 12, 2020

Semiconductor device and method of forming wafer level ground plane and power ring

STATS CHIPPAC PTE LTD0 citations51